A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

A method of forming a curved slot in a turbine disk includes the steps of forming a pre-slot in the turbine disk and finishing the pre-slot to form a slot that receives a portion of a turbine blade. The turbine disk including a first face, an opposing second face, and an outer perimeter surface extending between the first face and the opposing second face. The pre-slot includes a first curved wall and a second curved wall that each extend between the first face and the opposing second face. An intersection between the outer perimeter surface and each of the first curved wall and the second curved wall is defined by a curved line.

Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

Thread repair tools having (i) a disc-shaped member with an axis of rotation extending through and dissecting first and second major surfaces of the disc-shaped member, (ii) a shaft fixedly connected to or fixedly connectable to the disc-shaped member, with the shaft extending from the second major surface of the disc-shaped member along the axis of rotation; and (iii) an abrasive surface along an outer periphery of the disc-shaped member are disclosed. Methods of making the thread repair tools, and methods of using the thread repair tools are also disclosed. Methods of using the thread repair tools include a method of: (i) connecting the thread repair tool to a hand-held powered device capable of rotating the thread repair tool along the axis of rotation of the thread repair tool, and (ii) abrading an object with the disc-shaped member of the thread repair tool as the thread repair tool is rotated along the axis of rotation by the hand-held powered device.

Described is a method for grinding workpieces, which comprise at least one cylindrical and profiled portion each, on one and the same grinding machine. The workpiece is ground initially in a first grinding operation in a first clamping in the grinding machine, said first grinding operation being followed by a second grinding operation once the first clamping has been released and then, before the start of the second grinding operation, a second clamping has been generated.

An apparatus for cutting grooves in a ground surface includes a wheeled vehicle with a tool carrier connected to the wheeled vehicle. The tool carrier is rotatable about an axis parallel to the direction of travel of the vehicle and perpendicular to the direction of travel of the vehicle. A grinding tool for cutting grooves in a ground surface is rotatably mounted to the tool carrier. The grinding tool may be movable laterally relative to the vehicle. A rotatable cam is configured so that rotation of the cam causes pivotal movement of the tool carrier relative to the forward frame. Rotation of the cam moves the grinding tool into and out of engagement with the ground surface.

A method of inspecting a cutting blade having a cutting edge formed of abrasive grains of selected abrasive grain diameters which are bound by a bonding material, includes a cutting step of moving the chuck table and the cutting blade, which is being rotated at a high speed, relatively to each other along a direction perpendicular to an axis of rotation of a spindle, thereby forming a cut groove in the workpiece, and an inspecting step of capturing an image of the cut groove formed in the workpiece by image capturing means, and inspecting the state of the cut groove. The inspecting step examines whether or not the selected abrasive grain diameters are proper on the basis of any of the elements representing the size of an average chip, the number of chips, and the area of chips on both sides of the cut groove per unit length.

A method of inspecting a cutting blade having a cutting edge formed of abrasive grains of selected abrasive grain diameters which are bound by a bonding material, includes a cutting step of moving the chuck table and the cutting blade, which is being rotated at a high speed, relatively to each other along a direction perpendicular to an axis of rotation of a spindle, thereby forming a cut groove in the workpiece, and an inspecting step of capturing an image of the cut groove formed in the workpiece by image capturing means, and inspecting the state of the cut groove. The inspecting step examines whether or not the selected abrasive grain diameters are proper on the basis of any of the elements representing the size of an average chip, the number of chips, and the area of chips on both sides of the cut groove per unit length.