Loopback rolls which can transfer and guide a polishing tape (T) along a perimeter of a pressure contact roll (R) is provided, the pressure contact roll having a tapered peripheral edge having a top edge and a pair of slant edge faces formed on a periphery of the pressure contact roll, by which the polishing tape can be bent into a substantially V-shape in cross section, and a switchable pressure contact mechanism is switchably provided which pressure contacts each of bent portions of the polishing tape, which is bent into the substantially V-shape in cross section by the tapered peripheral edge, to one tooth face (B1) or the other tooth face of a worm.

A polishing apparatus is configured to polish a peripheral edge of an object. The apparatus includes: a stage having a mounting surface to mount the object; a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge; a first inlet configured to supply liquid to the polishing surface; and a protector having a first surface extending along a first direction intersecting with the mounting surface, the first surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction.

There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.

This disclosure relates to a belt grinder includes frame and first grinding assembly. The first grinding assembly includes transmission roller set, grinding belt and adjusting assembly. The transmission roller set includes driving roller and driven roller. Both the driving roller and the driven roller are rotatably disposed on the frame. The grinding belt is installed over the driving roller and the driven roller. The adjusting assembly includes rotatable component and contact rollers. The rotatable component is rotatably disposed on the frame. Rotation axis of the rotatable component is parallel to rotation axis of the driving roller. The contact rollers are rotatably disposed on the rotatable component. Contact rollers are different in shape. The rotatable component is rotatable with respect to the frame so as to force one of the contact rollers to contact or to be separated from the grinding belt.

The method is for profiling blades with a belt grinding profiling machine. The blades are mounted into a vise. A vertical position of the template is adjusted by rotating the rotatable knob. The motor is turned on to rotate the grinding belt over the grinding wheel. The guide wheel engages the underside profile of the template. The guide wheel of the template guides movement of the grinding wheel mounted on the common axle by moving the guide wheel along the underside profile of the template. The grinding belt grinds material off the underside of the blade until a portion of the underside profile of the template is copied to the underside of the blade.

A blade for a skate for skating on ice. The blade includes ice-contacting material with an ice-contacting surface for contacting the ice. The ice-contacting surface has a machined longitudinal profile with a radius of curvature that varies smoothly over a majority of the length of the blade. Such a radius of curvature may, in some cases, be an elliptical arc.

The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.

A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.

The method is for profiling blades with a belt grinding profiling machine. The blades are mounted into a vise. A vertical position of the template is adjusted by rotating the rotatable knob. The motor is turned on to rotate the grinding belt over the grinding wheel. The guide wheel engages the underside profile of the template. The guide wheel of the template guides movement of the grinding wheel mounted on the common axle by moving the guide wheel along the underside profile of the template. The grinding belt grinds material off the underside of the blade until a portion of the underside profile of the template is copied to the underside of the blade.

A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.