The invention has a turnback roll which can transfer and guide a polishing tap in a tangential direction of a pressure contacting roll, a vertical oscillation mechanism which linearly oscillates the pressure contacting roll in a tangential direction of a ball groove while being orthogonal to a rotating axis line, and a horizontal oscillation mechanism which linearly oscillates the pressure contacting roll in a direction of a rotating axis line toward both inner side surfaces of the ball groove. The ball groove can be securely polished by the polishing tape on the basis of the continuous or intermittent transfer of the polishing tape and the linear oscillating motion of the ball groove. It is possible to improve a polishing precision, it is possible to improve a surface roughness of the ball groove and it is possible to improve a polishing workability of the ball groove.

The present application relates to a method for controlling a repairing apparatus and a repairing apparatus. The method for controlling the repairing apparatus includes: measuring, by a sensor, a height of a target object when a grinding part of the repairing apparatus completes positioning the target object; calculating an idle distance of a grinding belt on the grinding part in a predetermined process according to the height of the target object, in which, the predetermined process is the grinding part descending from the initial position to the highest position of the target object; and driving a motor to rotate back the grinding belt on the grinding part for the idle distance, and repairing the target object through the grinding belt on the grinding part.

A belt-finishing device including a frame. A pressing arm is configured to pivotally mount on the frame. A pressing element, which is used to press a finishing belt against a workpiece surface to be treated, is arranged on the pressing arm. The device is provided with a position detection system for detecting a pressing-arm actual position that deviates from a desired position of the pressing arm. A malfunction or defect of the pressing element is detected by means of the pressing arm actual position that deviates from the desired position of the pressing arm.

The invention relates to a pressing device for pressing a finishing belt against a workpiece surface, including a pressure belt and a pressure belt carrier which supports the pressure belt at two mutually spaced-apart support points, wherein the pressure belt is fastened releasably to the pressure belt carrier, wherein, in order to fix in each case one pressure belt end, provision is made of a fixing device that is provided separately from the pressure belt carrier, and wherein the fixing device is fastened or fastenable releasably to the pressure belt carrier in a state in which one pressure belt end is fixed to the fixing device.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A polisher includes a wafer carrier, a polishing head, a movement mechanism, and a rotation mechanism. The wafer carrier has a supporting surface. The supporting surface is configured to carry a wafer thereon. The polishing head is present above the wafer carrier. The polishing head has a polishing surface. The polishing surface of the polishing head is smaller than the supporting surface of the wafer carrier. The movement mechanism is configured to move the polishing head relative to the wafer carrier. The rotation mechanism is configured to rotate the polishing head relative to the wafer carrier.

A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.

The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

The invention relates to a pressing device for pressing a finishing belt against a workpiece surface, including a pressure belt and a pressure belt carrier which supports the pressure belt at two mutually spaced-apart support points, wherein the pressure belt is fastened releasably to the pressure belt carrier, wherein, in order to fix in each case one pressure belt end, provision is made of a fixing device that is provided separately from the pressure belt carrier, and wherein the fixing device is fastened or fastenable releasably to the pressure belt carrier in a state in which one pressure belt end is fixed to the fixing device.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.