The present invention relates to a one-circle two-chamfer deburring machine and a deburring method comprising the following steps after starting up: (1) The upper wheelhead motor drives the upper grinding belt to rotate horizontally (2) the lower wheelhead motor drives the lower grinding belt to rotate horizontally and (3) when a deburred workpiece goes through a passage formed by the active feeding roller row and the upper grinding belt, an upper abrasive block elastically contacts surface of the workpiece and, under the drive of the upper wheelhead motor and the upper active drum, polishes and deburrs the front side of the workpiece twice; the lower abrasive block elastically contacts the surface of the workpiece and, under the drive of the lower wheelhead motor and the lower active drum, polishes and deburrs the back side of the workpiece twice.

An abrasive belt grinding center applicable to grinding and polishing of a whole profile of a blisk is provided, an X-axis feed mechanism, a Y-axis feed mechanism, a Z-axis feed mechanism, a B-axis rotation mechanism and a C-axis rotation mechanism constitute a grinding head feed mechanism, and a housing, a drum, a synchronous driven pulley, a synchronous belt, a synchronous driving pulley, and a grinding head rotation driving motor constitute a grinding head rotation mechanism. In the present application, two grinding heads are utilized to reasonably assign the machining angle and the feeding, and rough machining and fine machining can be both realized by one time of clamping, and the combination of six degrees of freedom in space is achieved by a short drive chain, and further the rigidities of a grinding head mechanism and a workpiece clamping mechanism are ensured.

Disclosed herein are a metal plate including a plurality of pattern portions, a patterning apparatus configured to form a plurality of patterns on the metal plate, and a patterning method using the same. The metal plate to be used in a household appliance includes a plurality of pattern portions in which a hairline pattern is formed on a surface of the metal plate, wherein the plurality of pattern portions includes a first pattern portion having a first hairline pattern and a second pattern portion having a second hairline pattern different from the first hairline pattern.

The present invention provides a wheel burr removing device, which includes a frame, cylinders, guide posts, brush systems I, brush systems II and a clamping rotating system. The device in the present invention not only can be used for adjusting the angles of brushes II according to the size and the shape of the wheel so as to focus on removing burrs at the root of the rim, but also can be used for specifically removing burrs at the roots of flanges and the middle parts of spokes; meanwhile, the device has the characteristics of high automation degree, advanced process, simple structure and high safety and stability.

A polisher includes a wafer carrier, a polishing head, a movement mechanism, and a rotation mechanism. The wafer carrier has a supporting surface. The supporting surface is configured to carry a wafer thereon. The polishing head is present above the wafer carrier. The polishing head has a polishing surface. The polishing surface of the polishing head is smaller than the supporting surface of the wafer carrier. The movement mechanism is configured to move the polishing head relative to the wafer carrier. The rotation mechanism is configured to rotate the polishing head relative to the wafer carrier.

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.

The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

A device for finish-machining a workpiece in the form of a crankshaft or a camshaft includes a workpiece holder and a rotational drive configured to rotate the workpiece about a workpiece axis. A first finishing tool is configured to machine a main bearing which is concentric with the workpiece axis. A second finishing tool is configured to machine an additional bearing which is radially offset from the workpiece axis. A first tool drive is configured to generate an oscillating movement of the first finishing tool in a direction parallel to the workpiece axis. A second tool drive is configured to generate an oscillating movement of the second finishing tool which is independent of the movement of the first finishing tool in a direction parallel to the workpiece axis.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof, wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.