Patent classifications
B24B21/02
WORM POLISHING METHOD AND DEVICE THEREOF
Loopback rolls which can transfer and guide a polishing tape (T) in a tangential direction of a pressure contact roll (R) is provided, a top edge face (RG1) and a tapered peripheral edge (RG) having a pair of slant edge faces (RG2) are formed on a periphery of the pressure contact roll, by both of which the polishing tape can be bent into a substantially V-shape in cross section, and a switchable pressure contact mechanism (7) is switchably provided which pressure contacts each of bent portions (T) of the polishing tape, which is bent into the substantially V-shape in cross section by the tapered peripheral edge to one tooth face (B1) or the other tooth face of a bottom land (B) of a worm (W).
Pressing device having a toothed belt
A pressing device (1) for pressing finishing tape against circumferential surfaces (2) of substantially cylindrical work piece sections (3) in a finishing process includes at least one elastically bendable pressing element (5) that is substantially inelastic in the longitudinal direction. A support element (6) has two bearings (7), which are arranged at a distance from each other. The pressing element (5) is fastened to the two bearings, and the two bearings are arranged in such a manner that finishing tape is pressed against a circumferential surface (2) by the pressing element (5) across a contact angle (4) using a pressing force. The pressing device (1) is adjustable in order to process work piece sections (3) of different diameters. The pressing element may be a toothed belt (5) having tooth-like ribs (8), and the toothed belt (5) is interlockingly mounted in the support element (6) using the tooth-like ribs (8).
Pressing device having a toothed belt
A pressing device (1) for pressing finishing tape against circumferential surfaces (2) of substantially cylindrical work piece sections (3) in a finishing process includes at least one elastically bendable pressing element (5) that is substantially inelastic in the longitudinal direction. A support element (6) has two bearings (7), which are arranged at a distance from each other. The pressing element (5) is fastened to the two bearings, and the two bearings are arranged in such a manner that finishing tape is pressed against a circumferential surface (2) by the pressing element (5) across a contact angle (4) using a pressing force. The pressing device (1) is adjustable in order to process work piece sections (3) of different diameters. The pressing element may be a toothed belt (5) having tooth-like ribs (8), and the toothed belt (5) is interlockingly mounted in the support element (6) using the tooth-like ribs (8).
Polishing and brushing techniques for cylindrical and contoured surfaces
Material removal processes of a structure are disclosed. These processes can define several features. For example, metal structure can include an interior recess surrounded by a sidewall. The structure can further include a base portion integrally formed with the sidewall. The sidewall can include an opening extending through the sidewall and into the interior recess. The sidewall can undergo a material removal process to include multiple curved regions. The sidewall, the first curved region, and the second curved region can be polished to include a reflectivity different than a reflectivity of an exterior region of the base portion. A single multi-axes lathe having multiple spindles performs several material removal processes under a continuous machine cutting process. The spindles may include clamping features that allow a first spindle to perform a first operation then pass the metal structure to a second spindle. Additional processes include lapping, polishing, and linear brushing.
Polishing and brushing techniques for cylindrical and contoured surfaces
Material removal processes of a structure are disclosed. These processes can define several features. For example, metal structure can include an interior recess surrounded by a sidewall. The structure can further include a base portion integrally formed with the sidewall. The sidewall can include an opening extending through the sidewall and into the interior recess. The sidewall can undergo a material removal process to include multiple curved regions. The sidewall, the first curved region, and the second curved region can be polished to include a reflectivity different than a reflectivity of an exterior region of the base portion. A single multi-axes lathe having multiple spindles performs several material removal processes under a continuous machine cutting process. The spindles may include clamping features that allow a first spindle to perform a first operation then pass the metal structure to a second spindle. Additional processes include lapping, polishing, and linear brushing.
SUBSTRATE, EDGE POLISHING DETECTION METHOD AND DEVICE AND POSITIONING METHOD AND DEVICE FOR THE SAME, EXPOSURE APPARATUS AND EVAPORATION DEVICE
A substrate, an edge polishing detection method and device and a positioning method and device for the same, an exposure apparatus and an evaporation device are provided. The substrate includes a base substrate and at least one edge polishing detection pattern on the base substrate. The at least one edge polishing detection pattern is provided at an edge of the base substrate and made of a conductive material.
Finishing device
A finishing device has a pressing arm and a pressing tool for pressing a finishing tool against a workpiece, and method for setting up the device, the device being provided with a first connecting device for connecting a base support to the pressing arm, a second connecting device for connecting the base support to the pressing tool and a setting device for setting the orientation and/or position of the base support on the pressing arm.
Finishing device
A finishing device has a pressing arm and a pressing tool for pressing a finishing tool against a workpiece, and method for setting up the device, the device being provided with a first connecting device for connecting a base support to the pressing arm, a second connecting device for connecting the base support to the pressing tool and a setting device for setting the orientation and/or position of the base support on the pressing arm.
Polishing apparatus and polishing method
A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
Polishing apparatus and polishing method
A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.