Disclosed herein are a metal plate including a plurality of pattern portions, a patterning apparatus configured to form a plurality of patterns on the metal plate, and a patterning method using the same. The metal plate to be used in a household appliance includes a plurality of pattern portions in which a hairline pattern is formed on a surface of the metal plate, wherein the plurality of pattern portions includes a first pattern portion having a first hairline pattern and a second pattern portion having a second hairline pattern different from the first hairline pattern.

Disclosed herein are a metal plate including a plurality of pattern portions, a patterning apparatus configured to form a plurality of patterns on the metal plate, and a patterning method using the same. The metal plate to be used in a household appliance includes a plurality of pattern portions in which a hairline pattern is formed on a surface of the metal plate, wherein the plurality of pattern portions includes a first pattern portion having a first hairline pattern and a second pattern portion having a second hairline pattern different from the first hairline pattern.

An abrasive article includes a plurality of abrasive particles and the rotational orientation of at least a portion of the abrasive particles about the z-axis varies randomly within a defined range, and the spacing of the abrasive particles along the y-axis varies randomly.

An abrasive article includes a plurality of abrasive particles and the rotational orientation of at least a portion of the abrasive particles about the z-axis varies randomly within a defined range, and the spacing of the abrasive particles along the y-axis varies randomly.

An endless abrasive belt for a sanding machine includes a flexible support structure, on an upper side of the support structure, an active layer with a binder and abrasive grains held in the binder. A transponder device is affixed to an underside of the endless abrasive belt, the transponder device including an attachment region and a flag, the attachment region being glued onto the underside by an adhesive layer, the flag being held by the attachment region and projecting laterally away from the endless abrasive belt, and a transponder including a transponder chip and an aerial for a wireless data connection with the sanding machine is arranged in the flag.

Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.

Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.

Machining apparatus (2), in particular wide-belt sander for machining preferably board-type workpieces (W) preferably made at least in part of wood, engineered wood and/or plastic, comprising at least one light signal display device (10) which displays information on the machining apparatus (2) in such a way that the information displayed by the light signal display device (10) is visible to an operator.

Machining apparatus (2), in particular wide-belt sander for machining preferably board-type workpieces (W) preferably made at least in part of wood, engineered wood and/or plastic, comprising at least one light signal display device (10) which displays information on the machining apparatus (2) in such a way that the information displayed by the light signal display device (10) is visible to an operator.

A surface treatment process of a CMP (chemical mechanical polishing) polishing pad includes steps of rough-machining, fine-machining and finish-machining a substrate in sequence with an abrasive belt with a particle size of 120-mesh, an abrasive belt with a particle size of 240-mesh and an abrasive belt with a particle size of 400-mesh, respectively till a target thickness of the substrate is obtained. In each processing stage, the surface of the substrate is sanded through effectively adjusting the height of the corresponding abrasive belt so as to effectively control a surface roughness of the substrate. Moreover, through the surface treatment process provided by the present invention, the initial surface roughness is consistent with the surface roughness in the usage process of the substrate, so as to solve the problem that the initial grinding rate is unstable, thereby significantly improving the stability of the substrate in the CMP process.