A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.

The invention relates to a pressing device for pressing a finishing belt against a workpiece surface, including a pressure belt and a pressure belt carrier which supports the pressure belt at two mutually spaced-apart support points, wherein the pressure belt is fastened releasably to the pressure belt carrier, wherein, in order to fix in each case one pressure belt end, provision is made of a fixing device that is provided separately from the pressure belt carrier, and wherein the fixing device is fastened or fastenable releasably to the pressure belt carrier in a state in which one pressure belt end is fixed to the fixing device.

The invention relates to a pressing device for pressing a finishing belt against a workpiece surface, including a pressure belt and a pressure belt carrier which supports the pressure belt at two mutually spaced-apart support points, wherein the pressure belt is fastened releasably to the pressure belt carrier, wherein, in order to fix in each case one pressure belt end, provision is made of a fixing device that is provided separately from the pressure belt carrier, and wherein the fixing device is fastened or fastenable releasably to the pressure belt carrier in a state in which one pressure belt end is fixed to the fixing device.

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.

Apparatus for machining an object, the apparatus comprising: a wheel including; a first circular surface; a second circular surface oriented parallel to the first circular surface; a first rim surface extending from the first circular surface at a first edge, a gradient of the first rim surface having a radial component; and a second rim surface extending from the second circular surface at a second edge and towards the first rim surface, a gradient of the second rim surface having a radial component, the first edge defining a curved surface between the first circular surface and the first rim surface, and the second edge defining a curved surface between the second circular surface and the second rim surface.

According to one embodiment, a polishing device includes a stage, a polishing unit, a warp suppressing unit, and an adsorbing mechanism. A semiconductor wafer is mounted onto the stage. The stage is rotatable around a first shaft. The polishing unit applies a force to and polishes a rear surface of the semiconductor wafer mounted on the stage. The warp suppressing unit applies a force to, during the polishing, an outer circumferential part of a front surface of the semiconductor wafer. The adsorbing mechanism adsorbs, during the polishing, a first region in the rear surface of the semiconductor wafer. The first region is on a center side relative to an area at which the polishing is performed.

According to one embodiment, a polishing device includes a stage, a polishing unit, a warp suppressing unit, and an adsorbing mechanism. A semiconductor wafer is mounted onto the stage. The stage is rotatable around a first shaft. The polishing unit applies a force to and polishes a rear surface of the semiconductor wafer mounted on the stage. The warp suppressing unit applies a force to, during the polishing, an outer circumferential part of a front surface of the semiconductor wafer. The adsorbing mechanism adsorbs, during the polishing, a first region in the rear surface of the semiconductor wafer. The first region is on a center side relative to an area at which the polishing is performed.

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.

A protective cover assembled on an abrasive belt hand tool. The protective cover comprises an annular base and a tightening component. The annular base comprises a notch, a first clamping arm positioned on one side of the notch, and a second clamping arm positioned on the other side. The first clamping arm is formed with a through hole, the second clamping arm is formed with an assembly hole, the assembly hole does not penetrating through the second clamping arm. The annular base comprises a first state for tightening a protective cover mounting portion when the first clamping arm and the second clamping arm narrow the notch, and the annular base comprises a second state that the first clamping arm and the second clamping arm do not narrow the notch. The tightening component comprises a pull rod penetrating through the through hole and a piece arranged on the pull rod.