A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area.

A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area.

A method of repairing a defect in a damaged rail of a railroad track comprises positioning a rail profiling device on the rails of the railroad track proximate a defect; securing the rail profiling device to the railroad; adjusting its grinder according to a selected value of wheel cone angle to create a profiled running surface over a portion of the damaged rail; creating a median zone using the grinder to remove material from the damaged rail adjacent the defect at a depth corresponding to at least a maximum depth of the defect; creating an incline from the top of the rail and leading to the median zone and one incline leaving the median zone to the top of the rail by using the grinder to grinding material off the damaged rail.

A method of repairing a defect in a damaged rail of a railroad track comprises positioning a rail profiling device on the rails of the railroad track proximate a defect; securing the rail profiling device to the railroad; adjusting its grinder according to a selected value of wheel cone angle to create a profiled running surface over a portion of the damaged rail; creating a median zone using the grinder to remove material from the damaged rail adjacent the defect at a depth corresponding to at least a maximum depth of the defect; creating an incline from the top of the rail and leading to the median zone and one incline leaving the median zone to the top of the rail by using the grinder to grinding material off the damaged rail.

A jig and tool are provided for rotating the tool around a pipe or pipeline, for truing the pipe end. An operator can easily installation the jig into the pipe end, with or without the cutting tool installed thereto. The tool can be manually or motor driven for rotation about the jig and the pipe end. The attachment of the tool to the jig enables alignment of the tool's cutting face with the pipe end, with angular and axial adjustment available for obtaining a profile suitable for welding to like pipe ends. In an embodiment, the tool can track the pipe diameter to retain alignment despite out-of-round dimensional variation. The tool is operated and rotated about the pipe end to remove material and, as necessary, the tool is adjusted into the pipe end and the rotation about the pipe end is repeated for incremental removal of material therefrom.

An apparatus for surface finishing a flange surface of a flange of a pipe includes a frame assembly, a drive assembly coupled to the frame assembly, and a bracket assembly coupled to the frame assembly. The flange is clamped between the frame assembly and the drive assembly. The drive assembly circumferentially translates the apparatus around the pipe. A power tool is coupled to the bracket assembly to perform the surface finishing operation on the flange surface of the flange.

An apparatus (100) for cutting workpieces comprises a clamping mechanism (2) adapted to be fastened to said workpiece (1) rotatably therearound. The clamping mechanism (2) comprises a frame element (5) and first and second arms (6, 7) extending therefrom. The arms (6, 7) are coupled at one end to the frame element (5) of the clamping mechanism (2) and each arm (6, 7) has its free end fitted with a contacting member (15, 16, 31, 32) configured to contact the surface of the workpiece. The apparatus comprises also two movable guiding members (28, 29) to which said arms (6, 7) are coupled so that when said guiding members (28, 29) are moved away from each other, the contacting member (15, 16, 31, 32) of the arms (6, 7) are configured to be moved away from each other and vice versa. The apparatus comprises also at least two supporting bars (50, 51) elongated through said guiding members (28, 29). The first supporting bar (50) comprises a first threaded portion (52) with a first coupling means (21), and the second supporting bar (51) comprising a second threaded portion (53) with a second coupling means (22). The first arm (6) and the first coupling means (21) are functionally coupled to each other by a first suspension arm (24), and the second arm (7) and the second coupling means (22) are functionally coupled to each other by a second suspension arm (25). The supporting bars are configured to be rotated at the same time.

An apparatus (100) for cutting workpieces comprises a clamping mechanism (2) adapted to be fastened to said workpiece (1) rotatably therearound. The clamping mechanism (2) comprises a frame element (5) and first and second arms (6, 7) extending therefrom. The arms (6, 7) are coupled at one end to the frame element (5) of the clamping mechanism (2) and each arm (6, 7) has its free end fitted with a contacting member (15, 16, 31, 32) configured to contact the surface of the workpiece. The apparatus comprises also two movable guiding members (28, 29) to which said arms (6, 7) are coupled so that when said guiding members (28, 29) are moved away from each other, the contacting member (15, 16, 31, 32) of the arms (6, 7) are configured to be moved away from each other and vice versa. The apparatus comprises also at least two supporting bars (50, 51) elongated through said guiding members (28, 29). The first supporting bar (50) comprises a first threaded portion (52) with a first coupling means (21), and the second supporting bar (51) comprising a second threaded portion (53) with a second coupling means (22). The first arm (6) and the first coupling means (21) are functionally coupled to each other by a first suspension arm (24), and the second arm (7) and the second coupling means (22) are functionally coupled to each other by a second suspension arm (25). The supporting bars are configured to be rotated at the same time.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.