Patent classifications
B24B27/0015
POLISHING TOOLS AND METHODS OF POLISHING SUBSTRATES
Polishing tools and methods of polishing a glass substrate are disclosed. A polishing tool (200) includes a stem (220) and a polishing material (210) bonded to the stem (220). The polishing material (210) includes, in volume concentration, about 18% to about 42% phenolic resin, about 18% to about 30% zinc oxide, about 1% to about 10% magnesium oxide, a cooling agent, and an abrasive.
Washing device and barrel polishing system
According to an aspect of the present disclosure, there is provided a washing device that washes a barrel tank of a horizontal centrifugal barrel polishing device. The washing device includes a casing, a rotation mechanism, a washing nozzle, and a nozzle moving mechanism. The casing includes a frame to accommodate the barrel tank, and a rotary shaft extending from the frame. The rotation mechanism is a mechanism to rotate the frame around the rotary shaft. The washing nozzle is a nozzle to eject washing water. The washing nozzle is configured to be insertable into and removable from the barrel tank. The nozzle moving mechanism moves the washing nozzle in a direction where the washing nozzle is inserted into and removed from the barrel tank.
Sanding machine
A sanding machine for sanding panels, including a supporting structure, a sanding unit supported by the supporting structure, a surface for supporting and sliding of the panels located beneath the sanding unit and along which the panels are fed in a predetermined feed direction; the sanding unit including a trestle supporting a sanding belt, the trestle including a plurality of rollers having respective axes parallel to the supporting surface, the sanding belt being endless and looped around the rollers, one of the rollers being motorized to move the sanding belt during the sanding of the panels, the sanding unit further including at least one opposing member to force the belt against the panel to be sanded.
MULTI-HEAD DESIGN FOR ULTRASONIC IMPACT GRINDING OF CMCS
An ultrasonic impact grinding assembly includes a base with a mount for connecting a workpiece to the base and a first tool arm. The ultrasonic impact grinding assembly also includes a second tool arm. The first tool arm and the second tool arm each include a base end, a distal end, at least one joint between the base end and the distal end, and at least one actuator configured to move the at least one joint. A first ultrasonic impact grinding tool head is connected to the distal end of the first tool arm. A second ultrasonic impact grinding tool head is connected to the distal end of the second tool arm.
Robotic end effector including multiple abrasion tools
A robot system comprises a robotic end effector including first, second and third abrasion tools having backing pads in a triangular arrangement.
Machine for finishing a work piece, and having a highly controllable treatment tool
A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.
Polishing apparatus
A polishing apparatus connected to a robot arm and used to polish a workpiece includes a bracket, a polishing assembly, and a positioning assembly. The polishing assembly is mounted on the bracket and includes a driver and a polishing plate connected to the driver. The driver is capable of driving the polishing plate to rotate, and defines an annular positioning groove around the spin axis. The positioning assembly includes a first positioning plate and a second positioning plate mounted on the bracket and opposite to the first positioning plate. The first positioning plate and the second positioning plate are clamped into two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate.
Substrate polishing apparatus
A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABLE TREATMENT TOOL
A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABLE TREATMENT TOOL
A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.