Provided is an optical fiber ferrule polishing jig capable of fixing an optical fiber ferrule and releasing the optical fiber ferrule. An optical fiber ferrule polishing jig 10A has; a base 12a having insertion holes 20 into which optical fiber ferrules 51 can be detachably inserted; pivoting rods 13 which are adjacent to the insertion holes 20 of the base 12a and rotatable around lower end portions 36; fixing pieces 14a installed in installation recesses 19a formed in the base 12a to fix the optical fiber ferrules 51 with respect to the insertion holes 20 by being moved as the rods are pivoted; and a plurality of coil springs 15a installed in the installation recesses 19a to bias the fixing pieces 14a so as to release fixing of the optical fiber ferrules 51 with respect to the insertion holes 20.

An automatic machine for drilling and milling substantially flat glass sheets includes a machine body; an input conveyor provided with a motorized roller conveyor or roller belt that conveys the glass sheet by its lower edge; an input conveyance surface provided with idle gliding wheels; an output conveyor provided with a motorized roller conveyor or motorized belt that conveys the glass sheet by means of its lower edge; and an output conveyance surface provided with idle gliding wheels. The machine further includes at least one carriage provided with synchronous horizontal motion along the longitudinal axis X2; and at least one pair of working heads provided independently with a synchronous vertical motion for adjustment and feeding along the axes Y1 and Y2, wherein, each head bears a tool provided with rotary motion (cutting) and feeding motion along the axes Z1 and Z2.

A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

A support base supports a plate-shaped workpiece. The support base includes a flat plate-shaped box member having a support face for supporting a workpiece and a placement face that is a face on the opposite side to the support face and is placed on a holding face of a chuck table, a temperature measurement unit accommodated in the box member, and a battery accommodated in the box member and serving as a power supply for the temperature measurement unit. The temperature measurement unit includes a temperature measuring instrument that measures a temperature at the support face, and a recording unit that records the temperature measured by the temperature measuring instrument.

A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.

A finishing device for finish machining of a workpiece, in particular of a crankshaft or a camshaft, comprising a workpiece holder and a rotary drive for rotating the workpiece about the workpiece axis thereof, comprising at least one first finishing tool for machining a main bearing concentric to the workpiece axis and at least one second finishing tool for machining an additional bearing, wherein the finishing tools can be moved along a transport axis which extends via a working area defined by the workpiece holder so that the finishing tools can be moved into an additional area arranged outside the working area.

The invention relates to an apparatus for honing a bore in a workpiece, having an apparatus base, having a turntable arranged on the apparatus base, with a plurality of workpiece receptacles, having at least one loading station for loading and unloading from the workpiece receptacles, having at least one honing station with a horizontal honing unit and with a displacement device for displacing the horizontal honing unit relative to the turntable, and having at least one tool magazine for receiving a plurality of honing spindles.

A sanding machine, in particular for processing wood surfaces, includes a support and transport plane for the forwarding of the workpieces to be processed; and a belt sanding unit with a transverse abrasive belt inside which a pressure pad is arranged obliquely. The pressure pad is divided into a plurality of pressure elements which can be actuated individually and are controlled by respective sensors that constitute a control beam, Methods are described for compensating the different distances between sensor and respective pressure elements that avoid adaptations of the position of the workpiece to be processed, in particular if the machine contains further non inclined processing units. The sanding machine is particularly suitable even for the processing of large workpieces.

A system for repairing a paint defect of a part can have means for identifying the paint defect of the part, a robotic applicator, and a computer module. The robotic applicator can include a dispenser and a pad. The robotic applicator can be configured to position the dispenser and the pad adjacent to the paint defect of the part. The dispenser can be configured to atomize a composition into an atomized composition. The dispenser can be also configured to dispose a predetermined amount of the atomized composition on the paint defect. The pad can be configured to work the predetermined amount of the atomized composition on the paint defect. The computer module can be in communication with the robotic applicator. The computer module can be configured to control functions of the robotic applicator.