An automatic wet sanding apparatus is equipped with a suction unit having a suction nozzle that is located under an automatic wet sanding unit in a state where automatic wet sanding is performed and a suction device that generates a suction force for suctioning water through the suction nozzle, so that water having been used for automatic wet sanding can be suctioned through the suction nozzle. This can significantly reduce the amount of water containing sanding dust that flows down a painted surface under the suction nozzle, and thereby reduce the amount of sanding dust that remains on the painted surface after completion of automatic wet sanding. As a result, it is possible to achieve a quality finish on the painted surface while eliminating the need for the troublesome task of wiping off remaining sanding dust.

An air cylinder that changes the posture of an automatic wet sanding unit main body having sandpaper mounted thereon is provided with a guide rod, and an outer circumferential surface of the guide rod has grooves that extend along a shaft centerline of the guide rod and have an arc-shaped cross-section. Balls are interposed between a bottom of each groove and an inner surface of a bush that is provided inside the air cylinder. Thus, it is possible to make two objects compatible with each other: to achieve high-accuracy automatic wet sanding by enhancing the adaptability of the sandpaper to the shape of a painted surface through a reduction of the diameter of the piston rod; and to enhance the durability of the automatic wet sanding apparatus.

A multi-tool positioning and manufacturing system moves a workpiece among many tools, such as grinding wheels, each of which performs a manufacturing operation on the workpiece. The system moves the workpiece automatically, quickly, repeatably, and precisely among the tools, without any manual intervention. It can perform the same manufacturing operations as many separate tools, such as grinding the inner diameter, outer diameter, and rib of a tapered roller bearing cone. Because a machinist does not have to move the workpiece between machines for different operations, the total manufacturing process can be faster and higher yield than with separate tools. The system can also move a single dresser among the tools for dressing and truing, further increasing manufacturing efficiency by eliminating the need for separate dressers for separate tools.

A method of processing a wafer includes a cutting step of cutting the face side of the wafer with a cutting blade to form grooves therein along projected dicing lines, a first inspecting step of capturing an image of the grooves formed in the cutting step and inspecting a state of a chip in the captured image of the grooves, a protecting member sticking step of sticking a protective member to the face side of the wafer, a grinding step of holding the protective member side of the wafer on a chuck table and grinding a reverse side of the wafer to thin the wafer to a finished thickness, thereby dividing the wafer into device chips, a second inspecting step of capturing an image of the grooves exposed on the reverse side of the wafer and inspecting a state of a chip in the captured image of the grooves.

An integrated equipment for processing a plurality of fiber optic ferrules comprises a polishing system, a ferrule cleaning system, a drying system, a wiping system, and a robot system. The polishing system polishes a plurality of front end faces of the plurality of fiber optic ferrules mounted on a carrier. The ferrule cleaning system cleans the carrier and the fiber optic ferrules on the carrier after the fiber optic ferrules have been polished. The drying system dries the carrier and the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been cleaned. The wiping system wipes the front end faces of the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been dried. The robot system transfers the carrier to the polishing system, the ferrule cleaning system, the drying system, and the wiping system.

A design method of a semiconductor manufacturing apparatus which can satisfy a specification required by a user is disclosed. The design method of the semiconductor manufacturing apparatus includes creating a program setting file; creating a program installer from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of a requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing a program into a memory of a controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other.

An apparatus for chemical-mechanical polishing is provided, including: a plurality of polishing sections spaced apart from one another, each polishing section including: a bracket, a carrier head and a platen, the carrier head being disposed on the bracket and configured to move between a polishing position and a conveying position, in which when the carrier head is located at the polishing position, the carrier head is located above the platen; and a conveying assembly, the conveying assembly including: a rotating plate and a plurality of loading and unloading tables, the plurality of loading and unloading tables being spaced apart from one another, disposed on the rotating plate and configured to rotate along with the rotating plate, in which when the carrier head is located at the conveying position, the carrier head is corresponding to one of the plurality of loading and unloading tables.

The present disclosure provides an adjustable device for removing burrs of a back cavity of a wheel. The adjustable device for removing the burrs of the back cavity of the wheel includes a frame provided with a rotary table inside, a support frame is fixedly connected to the rotary table, and a left rotary table and a right rotary table are arranged on the support frame. The device is ingenious in design, novel in conception, high in universality, short in cycle time and high in efficiency, and is suitable for removing burrs of wheels in different specifications.

A system and a method for processing of optical lenses in which the processing takes place by means of different processing apparatus between which there is a respective transfer apparatus. The transfer apparatus are used both for longitudinal and also cross conveyance. Each processing apparatus has its own conveyor apparatus which is controlled by the processing apparatus itself. The transfer apparatus are controlled by a central transfer control.

Disclosed is a device for removing tool joint edge burrs from a cap opening of a wheel. The cap opening of the wheel is an opening configured to mount a decorative cap of the wheel. The tool joint edge burrs are formed inside the cap opening of the wheel during machining the wheel and are a circular edge inside the cap opening. The device includes a cutter system which is configured to remove the tool joint edge burrs from the cap opening of the wheel by a first cutting edge and a second cutting edge of the cutter system.