A machining apparatus machines an end face of a tapered roller with a grinding wheel. The machining apparatus includes a support mechanism configured to support the tapered roller, a wheel unit on which the grinding wheel is mounted, and a base configured to support the wheel unit so that the wheel unit is swivelable about a center line in a vertical direction. A machining point where the grinding wheel is brought into contact with the end face of the tapered roller supported by the support mechanism is located on an extension of the center line serving as a swivel center of the wheel unit.

A method of producing a liquid crystal panel includes a grinding process and a sealing process. The grinding process includes grinding at least one common liquid crystal panel including a liquid crystal layer, a pair of boards that sandwich the liquid crystal layer, and a frame-shaped sealing member sandwiched between the boards along the non-rectangular outline to remove a section of the sealing member and to leave a rest of the sealing member. The grinding process further includers forming a sealing member removed processed edge section of the common liquid crystal pane. The sealing member removed processed edge section includes edges of the boards corresponding to the section of the sealing member removed from the common liquid crystal panel. The sealing process includes applying a sealing resin to the sealing member removed processed edge section to fill a space between the edges of the board.

An abrasive belt grinding center applicable to grinding and polishing of a whole profile of a blisk is provided, an X-axis feed mechanism, a Y-axis feed mechanism, a Z-axis feed mechanism, a B-axis rotation mechanism and a C-axis rotation mechanism constitute a grinding head feed mechanism, and a housing, a drum, a synchronous driven pulley, a synchronous belt, a synchronous driving pulley, and a grinding head rotation driving motor constitute a grinding head rotation mechanism. In the present application, two grinding heads are utilized to reasonably assign the machining angle and the feeding, and rough machining and fine machining can be both realized by one time of clamping, and the combination of six degrees of freedom in space is achieved by a short drive chain, and further the rigidities of a grinding head mechanism and a workpiece clamping mechanism are ensured.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

In certain embodiments, a system is provided for the efficient removal of an old grip from a fishing pole while maintaining the integrity of the pole. The system can include a removal portion including one or more rotational assemblies that rotate one or more grinding members. The grinding members can include a rotational blade with a centering rod. The rotational assembly can remove the old grip while maintaining the integrity of the rod within. The system can include multiple sets of grinding members that are organized for efficient identification or may include adjustable grinding members that can be configured for specific rods. The system can further include a guide to help identify particular grinding members for use with particular fishing poles.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

A honing assembly, a sanding assembly and a turning machine for performing an operation on a workpiece. The turning machine may include a rotatable machine housing operable to rotate around the workpiece; a first attachment including a first portion engageable with and operable to remove material from a workpiece, the first attachment having a first configuration, such as a honing attachment; and a second attachment including a second portion engageable with and operable to remove material from a workpiece, the second attachment having a second configuration, such as a sanding attachment, different than the first configuration, each of the first attachment and the second attachment being selectively supportable one at a time by the machine housing to operate on a workpiece.

Apparatus for working a sheet comprising movement means configured to move at least one sheet at a time in a direction of advance, and at least one working unit comprising a working head on which there are installed at least one working tool and a stabilizer device having opposite first gripping members and second gripping members facing each other, and reciprocally mobile along an axis of grip and release to tighten said sheet between them and to release it.

Method for holding and performing work on a sheet is provided. Sheet has a first lateral surface, an opposing second lateral surface and a perimeter edge. The method includes: a step of holding the sheet, a step of working the perimeter edge and also a coordinated step of moving the sheet and/or a step of moving the work head.