Patent classifications
B24B27/0038
POLISHING AMOUNT ESTIMATION DEVICE
There is provided a polishing amount estimation device which can facilitate the setting of parameters of teaching trajectory or force control in a polishing operation. A polishing amount estimation device for estimating a polishing amount in a polishing operation which is performed by bringing a polishing tool mounted on a robot manipulator into contact with a target workpiece by force control includes a memory which stores a motion program, and a polishing amount estimation part configured to estimate the polishing amount based on at least one of a motion trajectory of the polishing tool, a movement speed of the polishing tool, and a pressing force of the polishing tool against the target workpiece, which are obtained based on the motion program.
PROCESSING APPARATUS, OPERATION METHOD OF PROCESSING APPARATUS, AND NON-TRANSITORY COMPUTER READABLE RECORDING MEDIUM
A processing apparatus includes an articulated robot having an arm distal-end portion to which a processing tool configured with a cutting edge portion and a profiling portion and a shape measurement unit are attached, and a processor. The processor, in a workpiece set state, recognizes, by measuring a shape of the workpiece using the shape measurement unit, a tilt of a profiled surface portion of the workpiece and a position of a process portion of the workpiece to generate processing-target-portion information based on the position of the process portion, generates processing-point information indicating a processing point, moves the arm distal-end portion to the processing point based on the processing-point information, controls an orientation of the processing tool in accordance with the tilt of the profiled surface portion of the workpiece to perform the specified processing on the workpiece using the processing tool.
Orbital Grinding Machine Having a Braking Device
The invention relates to a device with a machine tool and a braking device, the machine tool having an eccentrically supported, rotatable backing pad for receiving a tool. According to one embodiment, the braking device has a frame, which is attached to the machine tool; a spring, a first end of which is fixed on the frame; and a lever, which is connected to a second end of the spring. The braking device also has an actuator, which is designed to move the lever, wherein in the event of a movement of the lever, the spring is compressed and a part of the lever is pressed against the backing pad of the machine tool.
ARTICULATING APPARATUS OF A WATERJET SYSTEM AND RELATED TECHNOLOGY
A waterjet system in accordance with at least some embodiments includes a carriage, a motion assembly configured to move the carriage horizontally relative to a workpiece, and a cutting head carried by the carriage. The waterjet system can also include a kinematic chain through which the cutting head is operably connected to the carriage. The kinematic chain can include first, second, and third joints rotatably adjustable about different first, second, and third axes, respectively. The carriage and the first and second joints can be configured to move the cutting head along a path relative to the workpiece while the cutting head directs a jet toward the workpiece to form a product. The third joint can be configured to shift a kinematic singularity away from the path to reduce or eliminate delay and corresponding reduced cutting accuracy associated with approaching the kinematic singularity.
ADDITIVELY MANUFACTURED METAL FRAME
A method of manufacturing is provided, including forming a metal frame of a head-mounted computing device shaped as a pair of eyeglasses. Forming the metal frame may include additively manufacturing the metal frame of the head-mounted computing device by performing laser sintering on aluminum powder or titanium powder. Forming the metal frame may further include removing an outer surface of the metal frame via a reductive process.
Automatic polishing system
In an automatic polishing system configured such that under control of a polishing robot and/or a polishing tool by a polishing controller, the polishing tool provides a polishing action on a polishing subject face, a color intensity measurement instrument is provided for measuring an intensity of a specified color in the polishing subject face. Based on the intensity of the specified color measured by this color intensity measurement instrument, the polishing controller controls the polishing robot and/or the polishing tool, so that an amount of polishing work by the polishing tool onto the polishing subject face is adjusted according to the intensity of the specified color.
Grinder selection device and grinder selection method
A grinder selection device includes: an input unit that inputs a grinding condition for a workpiece as a grinding target of grinding machining including at least the geometry of the workpiece and vibration data indicating vibration of a grinding machine, and grinder information about one or more grinders as grinder candidates to be used for the grinding machining; a learned model acquired through supervised learning using training data containing input data and label data, the input data containing an arbitrary grinding condition for a workpiece as a grinding target of grinding machining by an arbitrary grinding machine including at least the geometry of the workpiece and vibration data indicating vibration of the grinding machine, and grinder information about an arbitrary grinder, the label data being data indicating the adequacy or inadequacy of a combination between the grinding condition and the grinder information about the grinder; and a judgment unit.
GRINDING OR POLISHING DEVICE AND METHOD FOR TREATING OF A WORKPIECE
A grinding or polishing device and a method for treating a workpiece are provided. The grinding or polishing device includes a tool holder for holding a grinding or polishing tool and a mounting head for mounting the tool holder to a multi-axis manipulator. The tool holder is rotatable with respect to the mounting head about a pivot axis. The grinding or polishing device further includes a sensor for converting at least one parameter indicative of an angular position of the tool holder about the pivot axis into an output signal that can be used for determining a control signal for controlling the multi-axis manipulator.
Compensation of Positional Tolerances in the Robot-assisted Surface Machining
A device for robot-assisted machining of surfaces is described below. According to an example, the device has a retainer with a base plate designed for mounting on a manipulator and has an assembly suspended on the retainer, the assembly comprising a machine tool. The retainer has a tilt mechanism which couples the assembly to the retainer in such a way that the assembly can be tilted relative to the base plate about two axes of rotation, wherein the two axes of rotation can intersect with one another and run through the assembly below the base plate.
Automatic wet sanding apparatus
An air cylinder that changes the posture of an automatic wet sanding unit main body having sandpaper mounted thereon is provided with a guide rod, and an outer circumferential surface of the guide rod has grooves that extend along a shaft centerline of the guide rod and have an arc-shaped cross-section. Balls are interposed between a bottom of each groove and an inner surface of a bush that is provided inside the air cylinder. Thus, it is possible to make two objects compatible with each other: to achieve high-accuracy automatic wet sanding by enhancing the adaptability of the sandpaper to the shape of a painted surface through a reduction of the diameter of the piston rod; and to enhance the durability of the automatic wet sanding apparatus.