A device for removing burrs from an aluminum alloy wheel includes a workbench, columns fixedly connected to the workbench, a brush, a spindle, a spindle box, a cross beam connected to and adjustable along the columns, a spindle motor, a controller, a parallel robot, and a displacement sensor. The spindle box is connected to the cross beam and moves horizontally on the cross beam; the spindle, the spindle motor and the controller are mounted on the spindle box, and the brush is mounted at the end of the spindle; the brush is driven by the spindle motor and controlled by the controller; and the displacement sensor is mounted in the brush. The parallel robot is configured to implement precise six-dimensional adjustment, and perform real-time posture adjustment according to the instruction of the controller to ensure that the brush is always attached to the spoke back cavity.

[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

A machine for machining workpieces includes a movably mounted table (1) and at least one clamp (2). Each clamp is engageable with a workpiece and can be rotatably driven relative to the table. Each workpiece is transportable by movement of the table to a first workstation (3). Workstation 3 includes a toolholder (4) that holds a tool that is operative to machine a surface of the workpiece. The toolholder is movable in engagement with the workpiece by a feed unit (5) and the orientation of the tool holder relative to the workpiece is changeable by movement of an alignment unit (6). A second workstation to which the workpiece is moved after machining includes a cleaning device (8). A third workstation to which the workpiece is moved after cleaning includes a measuring device (10) that optically determines at least one surface property of the machined surface. The measuring device is in connection with an evaluation unit (14). The evaluation unit evaluates the at least one surface property and determines a direction and an order of magnitude that the alignment unit must be adjusted so at least one subsequently machined workpiece meets required tolerance specifications.

[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

A grinding machine for grinding of a profile, comprising a machine bed, wherein a machining device is arranged on the machine bed, wherein the machining device comprises a swivel head which carries a first grinding spindle with a first grinding tool, especially with a roughing grinding tool, and a second grinding spindle with a second grinding tool, especially with a finishing grinding tool, wherein a workpiece carrier being a rotary table is arranged on the machine bed. To allow the production of workpieces with a complex geometry in a high precision in an economical manner the invention proposes that the swivel head further carries at least one third grinding spindle with a third grinding tool, wherein the swivel axle of the swivel head is directed horizontally and the axis of rotation of the rotary table is directed vertically.

A gin blade sharpening system for sharpening a blank into a blade disk. The gin blade sharpening system comprises two or more grinding stations, a controller, and one or more upper grinders. The one or more upper grinders comprise at least a first upper grinder. The two or more grinding stations comprise at least a first grinding station and a second grinding station. Each among the two or more grinding stations comprise a clamp assembly configured to selectively hold the blade disk in a substantially horizontal position. A portion of the one or more upper grinders can be configured to sharpen an outer perimeter edge of the blade disk using an abrasive pad.