A machine (10) for machining workpieces with optical quality has at least one workpiece spindle (12), which rotatably drives a workpiece (L) to be machines about a workpiece axis of rotation (C). A swivel head (14) located opposite the workpiece spindle, is pivotable about a pivot axis (B), and bears at least two tool spindles (16, 18), each of which rotatably driving at least one machining tool (T1, T2, T3) about a tool axis of rotation (D, D). The workpiece spindle and the swivel head (14) are adjustable relative to one another along three mutually perpendicular linear axes (X, Y, Z). One axis (Y) extends parallel to the pivot axis (B). Another axis (Z) extends parallel to the axis (C) of workpiece rotation. At least one tool spindle is attached to the swivel head with its tool axis of rotation (D) extending parallel to the pivot axis (B).

A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.

A grinding machine for machining workpieces includes a workpiece headstock and two grinding headstocks. A first grinding headstock has two grinding spindles each with one grinding wheel for grinding first and second planar and non-planar external surfaces. A second grinding headstock has a grinding spindle having a grinding wheel for grinding a central bore in the workpiece, and a clamping device to clamp the workpiece. First, the bore and the first planar and any non-planar external surface are ground on one side of the workpiece. Then, the workpiece is clamped in the bore. The second planar external surface can then be ground in the same grinding machine with one of the grinding wheels of the first headstock. The clamping device attached to the second grinding headstock is such that the central axis of the clamping device is exactly aligned with the central axis of the workpiece headstock.

A polishing machine with an automatic feed and discharge function includes a machine frame, a clamping mechanism, a polishing shaft, a feed mechanism and a discharge mechanism. The clamping mechanism, the discharge mechanism, the polishing shaft and the feed mechanism are mounted on the machine frame. Multiple polishing heads are mounted on the polishing shaft. The feed mechanism includes a feed frame, a sliding platform, a sliding drive member, multiple columns of storage mechanisms for storing polishing pads, and multiple columns of push mechanisms, and the number of the columns of the storage mechanisms matches the number of the columns of the push mechanisms. The feed frame is mounted on the machine frame. The sliding platform is slidably arranged on the feed frame. The storage mechanisms are mounted on the sliding platform. The push mechanisms are mounted on the feed frame and are located above the storage mechanisms.

A grinding machine for grinding of a profile, comprising a machine bed, wherein a machining device is arranged on the machine bed, wherein the machining device comprises a swivel head which carries a first grinding spindle with a first grinding tool, especially with a roughing grinding tool, and a second grinding spindle with a second grinding tool, especially with a finishing grinding tool, wherein a workpiece carrier being a rotary table is arranged on the machine bed. To allow the production of workpieces with a complex geometry in a high precision in an economical manner the invention proposes that the swivel head further carries at least one third grinding spindle with a third grinding tool, wherein the swivel axle of the swivel head is directed horizontally and the axis of rotation of the rotary table is directed vertically.

There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

A sanding machine, with a machine bed, two vertical supports arranged laterally at the machine bed, with a bridge displaceable on the vertical supports in a horizontal, linear Y-axis, with an X-sled displaceable at the bridge in a horizontal, linear X-axis, with a Z-sled displaceable at the X-sled in a vertical, linear Z-axis, with an operating spindle supported at the Z-sled, particularly a sanding spindle, with a machine table and a magazine wheel comprising tool holders for sanding disks, and which is rotational about an axis parallel in reference to the Z-axis, with the operating spindle being able to remove a tool from a tool holder and place it there when this tool holder is rotated into an exchange position, with the tool magazine being arranged underneath the machine table and in the area of the exchange position.

A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.