A cutting apparatus includes: a processing feeding unit that performs processing feeding of a chuck table adapted to hold a workpiece; and two cutting units in which rotational axes of two spindles coincide with each other and cutting blades mounted to the spindles face each other. Each cutting unit includes a flange mechanism in which the cutting blade having a cutting edge fixed to an outer peripheral edge of a one-side outer surface of a circular disk-shaped base is fixed to the spindle. The flange mechanism is fixed to a tip of the spindle, sucks an other-side outer surface of the base of the cutting blade, and fixes the cutting blade to the spindle with the one-side outer surface of the base exposed to the side of the tip of the spindle, and the one-side outer surfaces of the cutting blades fixed to the two cutting units.

A processing system for processing spectacle lenses and a method for processing spectacle lenses are proposed. The processing system has several processing stations, in particular a milling station, a turning station, a polishing station, a cleaning station and/or a signing station. Furthermore, the processing system has a transport system for transporting the spectacle lenses and/or transport containers for the spectacle lenses. Preferably, the processing system also has a common base frame and/or a common casing for the processing stations. In the processing system and/or with the method, several spectacle lenses can be processed simultaneously in different processing stations.

A method of grinding a surface of a workpiece that has surface irregularities includes a first grinding step of grinding the surface of the workpiece by a predetermined amount of stock removal while keeping a measuring element of a height gauge out of contact with the surface of the workpiece, thereafter, a height difference measuring step of bringing the measuring element of the height gauge into contact with the surface of the workpiece and measuring a height difference of surface irregularities on the surface of the workpiece with the height gauge, and a second grinding step of, if the measured height difference is larger than a preset range, grinding the surface of the workpiece while keeping the measuring element of the height gauge in contact with the surface of the workpiece until the measured height difference falls within the preset range.

A fine adjustment thread assembly couples a first part and a second part to each other while keeping the first part and the second part spaced apart, adjusts the distance between the first part and the second part, and detects a load applied to the second part. The assembly includes first external threads that can be brought into threaded engagement with first internal threads formed in the first part, second external threads that are axially spaced from the first external threads, that have a thread pitch different from that of the first internal thread, and that can be brought into threaded engagement with second internal threads formed in the second part. A joint portion between the first external threads and the second external threads houses a load sensor under a compressive load.

Methods and apparatus for finishing an edge of a glass sheet are described. The edge of the glass sheet is finished using two grinding wheels mounted on spindles so that the edge of the grinding wheels chamfer the edge of the glass sheet during relative movement of the grinding wheels and the glass sheet.

The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported and which is supported on the frame (160) in such a way that the roller carrier can be moved in a first direction (x). The device (100) comprises at least a second roller (103), which is supported on the frame (160), and a belt (102), which is guided at least around the two rollers (101, 103) and because of the tension of which a resulting belt force (102) acts on the roller carrier (401). The device (100) also comprises an actuator (302), which is mechanically coupled to the frame (160) and the roller carrier (401) in such a way that an adjustable actuator force (FA) acts between the frame (160) and the first roller (101) in the first direction (x). The belt (102) is guided by means of the second roller (103), or by means of the second roller (103) and further rollers (101a, 101b, 121a, 121b, 105), in such a way that the resulting belt force (FB, FB′) acting on the roller carrier (401) acts approximately in a second direction (y) orthogonal to the first direction (x) in the case of a target deflection of the actuator (302).

An eyeglass lens peripheral edge processing system includes a plurality of eyeglass manufacturing devices and a robot arm. The plurality of eyeglass manufacturing devices 1 perform mutually different steps out of a plurality of steps for processing the eyeglass lens, and include mutually different housings. The robot arm includes an arm unit and a holding unit. The arm unit has a plurality of joint portions. The holding unit is disposed in the arm unit to hold and release an object. The robot arm rotates the arm unit via the joint portion to move the object held by the holding unit. The robot arm rotates the arm unit to move the eyeglass lens between the plurality of eyeglass manufacturing devices.

A wafer producing apparatus includes: an ingot grinding unit configured to grind and planarize an upper surface of an ingot held by a first holding table; a laser applying unit configured to apply a laser beam of such a wavelength as to be transmitted through the ingot to the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be produced from an upper surface of the ingot held by a second holding table, to form a peel-off layer; a wafer peeling unit configured to hold the upper surface of the ingot held by a third holding table and peel off the wafer from the peel-off layer; and a carrying tray having an ingot support section configured to support the ingot and a wafer support section configured to support the wafer.

An apparatus for chemical-mechanical polishing is provided, including: a plurality of polishing sections spaced apart from one another, each polishing section including: a bracket, a carrier head and a platen, the carrier head being disposed on the bracket and configured to move between a polishing position and a conveying position, in which when the carrier head is located at the polishing position, the carrier head is located above the platen; and a conveying assembly, the conveying assembly including: a rotating plate and a plurality of loading and unloading tables, the plurality of loading and unloading tables being spaced apart from one another, disposed on the rotating plate and configured to rotate along with the rotating plate, in which when the carrier head is located at the conveying position, the carrier head is corresponding to one of the plurality of loading and unloading tables.

A wafer producing apparatus includes an ingot grinding unit that grinds the upper surface of an ingot to planarize the upper surface, a laser irradiation unit that positions the focal point of a laser beam with such a wavelength as to be transmitted through the ingot to a depth corresponding to the thickness of a wafer to be produced from the upper surface of the ingot and irradiates the ingot with the laser beam to form a separation layer, a wafer separating unit that separates the wafer from the ingot, and a tray having a support part that supports the separated wafer.