A three-dimensional object manufacturing method for manufacturing a three-dimensional object by ejecting a liquid shaping material and then solidifying the ejected shaping material includes: an interior forming process of forming an interior portion of the three-dimensional object by the shaping material; and a periphery forming process of forming a peripheral portion of a periphery of the interior portion by stacking a plurality of layers by the shaping material, where the shaping material for forming the interior portion in the interior forming process has a larger rigidity in a solid state compared to the shaping material for forming the peripheral portion in the periphery forming process, the periphery forming process is a process of forming a groove configuring one part of the peripheral portion, and the interior forming process is a process of forming the interior portion by placing the liquid shaping material in the groove.

A method cuts semiconductor wafers. The method includes: cutting a semiconductor ingot into a workpiece; and sawing the workpiece into slices using a wire grid having a fixed abrasive grain wire, while moving workpiece towards the wire grid. At a first contact of the workpiece with the wire grid, an initial cutting speed is less than 2 mm/min, coolant flow is less than 0.1 l/h and a wire speed is greater than 20 m/s. The workpiece is then guided through the wire grid until a first cutting depth is reached, and then the coolant flow is increased to at least 2000 l/h. The cutting speed is reduced to less than 70% of the initial cutting speed between the first contact of the workpiece with the wire grid up to a cutting depth of half a diameter of the cylinder, and is then increased.

A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular cross section, and a plurality endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

A wire saw apparatus including: a plurality of wire guides; a wire row formed of a wire which is wound around the plurality of wire guides and configured to reciprocatively travel in an axial direction; a nozzle configured to supply a coolant or slurry to the wire; a workpiece-holding portion configured to suspend and hold a workpiece plate having a workpiece bonded thereto with a beam interposed therebetween; a workpiece-feeding mechanism configured to press the workpiece against the wire row; and a mechanism configured to adjust a parallelism of axes of the plurality of wire guides around which the wire row is formed. Thereby, a wire saw apparatus and a method for manufacturing a wafer are provided which enable manufacturing of a wafer having any warp shape by controlling a warp in a wire travelling direction of a sliced workpiece.

A method for slicing a workpiece includes feeding and slicing a workpiece held by a workpiece holder with a bonding member therebetween, while reciprocatively traveling a fixed abrasive grain wire wound around multiple grooved rollers to form a wire row, so that the workpiece is sliced at multiple positions simultaneously. The bonding member has a grindstone part. The method includes, after the workpiece is sliced and before it is drawn out from the wire row, a fixed-abrasive-grain removal step of pressing the wire against the grindstone to remove fixed abrasive grains from the wire while reciprocatively traveling. In the fixed-abrasive-grain removal step, the wire rate is 100 m/min. or less, and the load on each line of the wire is 30 g or more. The method prevents a sliced workpiece from catching a wire and from causing saw mark and wire break in drawing out the wire after slicing.

A method for slicing a workpiece includes feeding and slicing a workpiece held by a workpiece holder with a bonding member therebetween, while reciprocatively traveling a fixed abrasive grain wire wound around multiple grooved rollers to form a wire row, so that the workpiece is sliced at multiple positions simultaneously. The bonding member has a grindstone part. The method includes, after the workpiece is sliced and before it is drawn out from the wire row, a fixed-abrasive-grain removal step of pressing the wire against the grindstone to remove fixed abrasive grains from the wire while reciprocatively traveling. In the fixed-abrasive-grain removal step, the wire rate is 100 m/min. or less, and the load on each line of the wire is 30 g or more. The method prevents a sliced workpiece from catching a wire and from causing saw mark and wire break in drawing out the wire after slicing.

A method of manufacturing a hexagonal Group-III nitride semiconductor plate crystal using a crystal cutting wire. where the hexagonal semiconductor crystal has one principal face on one side and another principal face on an opposite side, and the hexagonal semiconductor crystal is cut by causing the crystal cutting wire to move so as to (i) divide the one principal face and the another principal face and (ii) satisfy conditions of Expressions (A) and (B):
25°<α≤90°  Expression (A); and
β=90°±5°  Expression (B) where α represents an angle formed by a c axis of the hexagonal Group-III nitride semiconductor crystal and a normal line of a crystal face cut out by the wire, and β represents an angle formed by a reference axis, which is obtained by perpendicularly projecting the c axis of the hexagonal Group-III nitride semiconductor crystal to the crystal face cut out by the wire, and a cutting direction.

A method for manufacturing a wire saw apparatus including a wire supply reel; a long roller; wire guides; a wire winding reel; and a tension arm controlled to move within a control angle of ±A (°) set in advance and configured to apply tension to the wire, the method including the steps of: measuring a surface roughness Rmax of the long roller; measuring an angle a (°) of the tension arm at which the tension arm swings outside a range of the control angle set in advance while the wire is extending from the wire supply reel; calculating R1×2×A÷(|a|+A)=R2, where R1 (μm) represents the measured surface roughness Rmax of the long roller; and adjusting the surface roughness Rmax of the long roller to the calculated numerical value R2 or less. The method for manufacturing a wire saw apparatus can prevent the tension arm from greatly swinging outside the control range.

A method for manufacturing a wire saw apparatus including a wire supply reel; a long roller; wire guides; a wire winding reel; and a tension arm controlled to move within a control angle of ±A (°) set in advance and configured to apply tension to the wire, the method including the steps of: measuring a surface roughness Rmax of the long roller; measuring an angle a (°) of the tension arm at which the tension arm swings outside a range of the control angle set in advance while the wire is extending from the wire supply reel; calculating R1×2×A÷(|a|+A)=R2, where R1 (μm) represents the measured surface roughness Rmax of the long roller; and adjusting the surface roughness Rmax of the long roller to the calculated numerical value R2 or less. The method for manufacturing a wire saw apparatus can prevent the tension arm from greatly swinging outside the control range.

The present disclosure discloses a device for cutting connection of multi-piece module electrode which includes a stand, the stand is provided with a workbench and the workbench is connected with a height adjusting device. The device further includes an angle grinding device, the angle grinding device includes a polishing shaft and an angle grinder, the angle grinder is arranged on the polishing shaft, and the angle grinding device is provided with a saw blade. According to the characteristics of the module electrode, the angle grinding device is matched with the workbench to implement simultaneous electrode disconnecting operation of multiple electrodes of the module, so that the device not only has higher efficiency and better cutting effect, but also is suitable for universal saw blades, saves the cost, and is safer.