A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.

A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.

A cutting blade, which can cut an insulating film while suppressing exfoliation of the insulating film such as a Low-k film that is likely to be exfoliated upon cutting, is demanded. A cutting blade, that can meet this demand, has a binder and abrasive particles, in which the abrasive particles are fixed by the binder at least part of which is glassy carbon.

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

A stationary cutting machine for metalworking, backflow of, for example, sparks toward an operator is prevented. A dust collector box is installable behind a cutting blade of a stationary cutting machine for metalworking for cutting a workpiece including a metal material. The dust collector box is installable adjacent to a placement surface for the workpiece. The dust collector box includes a dust collecting port that receives sparks generated during cutting of the workpiece, a dust collecting passage through which the sparks received at the dust collecting port are to flow rearward, and a guide that guides the sparks into the dust collecting passage and prevents the sparks entering the dust collecting passage from flowing back to the dust collecting port.

A stationary cutting machine for metalworking, backflow of, for example, sparks toward an operator is prevented. A dust collector box is installable behind a cutting blade of a stationary cutting machine for metalworking for cutting a workpiece including a metal material. The dust collector box is installable adjacent to a placement surface for the workpiece. The dust collector box includes a dust collecting port that receives sparks generated during cutting of the workpiece, a dust collecting passage through which the sparks received at the dust collecting port are to flow rearward, and a guide that guides the sparks into the dust collecting passage and prevents the sparks entering the dust collecting passage from flowing back to the dust collecting port.

A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around multiple grooved rollers, the method including feeding a workpiece to the wire row for slicing while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof, thereby slicing the workpiece at multiple positions aligned in an axial direction of the workpiece simultaneously. The method includes: supplying a coolant for workpiece slicing onto the wire row when the workpiece is sliced with the fixed abrasive grain wire; and supplying a coolant for workpiece drawing, which differs from and has a higher viscosity than the coolant for workpiece slicing, onto the wire row when the workpiece is drawn out from the wire row after the slicing of the workpiece.

A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around multiple grooved rollers, the method including feeding a workpiece to the wire row for slicing while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof, thereby slicing the workpiece at multiple positions aligned in an axial direction of the workpiece simultaneously. The method includes: supplying a coolant for workpiece slicing onto the wire row when the workpiece is sliced with the fixed abrasive grain wire; and supplying a coolant for workpiece drawing, which differs from and has a higher viscosity than the coolant for workpiece slicing, onto the wire row when the workpiece is drawn out from the wire row after the slicing of the workpiece.

A method of producing a liquid crystal panel includes a grinding process and a sealing process. The grinding process includes grinding at least one common liquid crystal panel including a liquid crystal layer, a pair of boards that sandwich the liquid crystal layer, and a frame-shaped sealing member sandwiched between the boards along the non-rectangular outline to remove a section of the sealing member and to leave a rest of the sealing member. The grinding process further includes forming a sealing member removed processed edge section of the common liquid crystal panel. The sealing member removed processed edge section includes edges of the boards corresponding to the section of the sealing member removed from the common liquid crystal panel. The sealing process includes applying a sealing resin to the sealing member removed processed edge section to fill a space between the edges of the board.

An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 m or less.