A method of operating a dental polishing apparatus is provided, having a polishing unit driven by a dental machine tool. The polishing unit includes a circular polishing core and a circular polishing assembly particularly surrounding the polishing core. The polishing assembly also has a workpiece to be polished and the polishing assembly deforms elastically when in contact with the workpiece. A numerically controlled steering device moves the polishing assembly along a trajectory on and relative to the workpiece. The workpiece is immersed into the polishing assembly with a constant or substantially constant degree of immersion. The controller adjusts the degree of immersion based on process parameters.

In a substrate cleaning device, with a polishing head in contact with one surface of a substrate rotated by a spin chuck, the polishing head is moved at least between a center and an outer periphery of the substrate. Thus, the one surface of the substrate is polished by the polishing head, and contaminants present on the one surface of the substrate are removed. At this time, capacity for removing contaminants by the polishing head is changed according to a position in a radial direction of the substrate. The capacity for removing contaminants refers to capacity for scraping contaminants adhering to the one surface of the substrate, and suction marks, contact marks and the like remaining on the one surface of the substrate by polishing. It is possible to change the capacity for removing contaminants by adjusting a pushing force exerted on the one surface of the substrate from the polishing head, for example.

In a substrate cleaning device, with a polishing head in contact with one surface of a substrate rotated by a spin chuck, the polishing head is moved at least between a center and an outer periphery of the substrate. Thus, the one surface of the substrate is polished by the polishing head, and contaminants present on the one surface of the substrate are removed. At this time, capacity for removing contaminants by the polishing head is changed according to a position in a radial direction of the substrate. The capacity for removing contaminants refers to capacity for scraping contaminants adhering to the one surface of the substrate, and suction marks, contact marks and the like remaining on the one surface of the substrate by polishing. It is possible to change the capacity for removing contaminants by adjusting a pushing force exerted on the one surface of the substrate from the polishing head, for example.

A processing machine and a method of using the processing machine to process a block to form a dental prosthesis is provided. The processing machine includes a polishing jig. The polishing jig is for machining tools which makes it possible for a deteriorating machining tool to be used again without detaching the machining tool, with which the processing machine is equipped, from the processing machine. The polishing jig for machining tools comprises an attachment part to be attached to the processing machine; and a polishing face that is at least part of a surface of the polishing jig, the polishing face adapted to polish a processing part of a machining tool.

A processing machine and a method of using the processing machine to process a block to form a dental prosthesis is provided. The processing machine includes a polishing jig. The polishing jig is for machining tools which makes it possible for a deteriorating machining tool to be used again without detaching the machining tool, with which the processing machine is equipped, from the processing machine. The polishing jig for machining tools comprises an attachment part to be attached to the processing machine; and a polishing face that is at least part of a surface of the polishing jig, the polishing face adapted to polish a processing part of a machining tool.

A sputtering target that is less likely to cause abnormal discharge is manufactured. A method for manufacturing a sputtering target includes performing multi-stage polishing on a sputtering surface of a target material having a Vickers hardness of 100 or less being made of metal by using a plurality of abrasives having different grit numbers in ascending order of grit number from a small grit number to a large grit number.

A sputtering target that is less likely to cause abnormal discharge is manufactured. A method for manufacturing a sputtering target includes performing multi-stage polishing on a sputtering surface of a target material having a Vickers hardness of 100 or less being made of metal by using a plurality of abrasives having different grit numbers in ascending order of grit number from a small grit number to a large grit number.

To change the direction of water flowing toward a painted surface so as to flow toward the center side of a hood, a water deflecting member is provided that extends toward the center side of the hood while extending toward the painted surface as seen in a state where automatic wet sanding is performed. Thus, water bouncing off the painted surface is less likely to scatter over a wide area of the painted surface, and sanding dust is also less likely to scatter over a wide area of the painted surface. As a result, it is possible to eliminate the need for the troublesome task of wiping off sanding dust remaining on the painted surface, and to achieve a quality finish on the painted surface.

A glass sheet polishing assembly includes a support assembly having a mounting assembly disposed thereon. The mounting assembly interconnects the glass sheet and the support assembly in an operative position during a polishing procedure. A carriage is movable relative to the support assembly in a first direction relative to the glass sheet. A polishing assembly is movable along a length of the carriage in a second transverse direction. A drive assembly is disposed and structured to define a movable driving relation with the polishing assembly and the carriage to define a continuous path of travel of the polishing assembly over a surface of the glass sheet and to successively move both the carriage and the positioning assembly relative to the support assembly in the first direction and continuously move the polishing assembly along said carriage in the second transverse direction.

A glass sheet polishing assembly includes a support assembly having a mounting assembly disposed thereon. The mounting assembly interconnects the glass sheet and the support assembly in an operative position during a polishing procedure. A carriage is movable relative to the support assembly in a first direction relative to the glass sheet. A polishing assembly is movable along a length of the carriage in a second transverse direction. A drive assembly is disposed and structured to define a movable driving relation with the polishing assembly and the carriage to define a continuous path of travel of the polishing assembly over a surface of the glass sheet and to successively move both the carriage and the positioning assembly relative to the support assembly in the first direction and continuously move the polishing assembly along said carriage in the second transverse direction.