A rotating substrate is cleaned by a polishing head and a cleaning brush. A first trajectory is formed by movement of the polishing head along a first path. A second trajectory is formed by movement of the cleaning brush along a second path. A region in which the first and second paths overlap with each other is defined as an interference region. The polishing head moves from a center towards an outer peripheral end of the substrate, and it is determined whether the polishing head has moved out of the interference region. At a time point at which it is determined that the polishing head has moved out of the interference region, the cleaning brush starts moving from the outer peripheral end towards the center of the substrate.

A wheel deburring machine is capable of meeting the demand for mixed-line high-precision clamping in a wheel burr brushing process when being used and is ideal in effect, high in efficiency, safe and reliable in working and high in automation degree so as to be particularly suitable for mass production on a production line.

The cutter holder capable of polishing a workpiece has a body, a mandrel, a middle element and a brush assembly. The mandrel extends into the body. The middle element is mounted to the body with a part of the mandrel extending out of the middle element. The brush assembly is mounted with the part of the mandrel that extends out of the middle element.

The cutter holder capable of polishing a workpiece has a body, a mandrel, a middle element and a brush assembly. The mandrel extends into the body. The middle element is mounted to the body with a part of the mandrel extending out of the middle element. The brush assembly is mounted with the part of the mandrel that extends out of the middle element.

A grinding machine for grinding non-horizontal grinding surfaces comprises a deformation device which is disposed between a grinding power source and a grinding pad driven by the grinding power source. The deformation device includes a set of an offset unit and the deformation members disposed near one end of the grinding pad, wherein the offset units, the first deformation member and the second deformation member define deformation angles. Therefore, one end of the grinding pad is correspondingly fitted to various non-horizontal grinding surfaces independently through the variable angles of the deformation angle, especially for continuous irregular non-horizontal grinding surfaces. Thus, the present invention has excellent grinding effectiveness.

A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.

A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.

A substrate polishing apparatus including a stage configured to load a substrate, the stage having a flat surface, which is parallel to a first direction and a second direction, and on which the substrate is loaded, a pressing unit configured to exert a pressure on the substrate in a third direction, a rotary unit configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view, a plurality of polishing pads provided between the pressing unit and the substrate to be in contact with the substrate, and a nozzle part configured to supply a slurry onto the substrate. The polishing pads may be spaced apart from each other in a direction and may have a rectangular shape in the plan view.