Magnetic apparatuses and systems for shaping parts are described. One or more magnets can be used to direct a magnetically responsive fluid having magnetically responsive particles around surfaces of a part. The magnetically responsive fluid can include abrasive particles that follow movement of the magnetically responsive fluid across surfaces of the part and remove material from the part until the part takes on a desired shape. The magnetic apparatuses can be configured to provide a rough cut, similar to machining process, and/or a fine cut, similar to polishing or buffing process, to the part.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A system, fixture and method for media finishing a cluster of airfoils are provided. The fixture may include a base having a first end and a second end, a receptacle disposed on the base and configured to receive the stator cluster, and at least one mock airfoil disposed at each of the first and second ends of the base in alignment with the airfoils of the cluster.

A thread cutting tap and a method of treating the thread cutting tap, which includes a thread cutting portion including a plurality of cutting lands, is provided. Each cutting land has one or more thread cutting teeth in the chamfered section. Each thread cutting tooth includes a primary cutting edge. The method includes immersing at least the thread cutting portion in a bed of granules and effectuating relative movement between the thread cutting portion and the granules for generating an edge rounding of a first magnitude at the primary cutting edge of each tooth, and then exposing a subset of the thread cutting teeth to a dynamic plastic deformation treatment. The subset includes all the thread cutting teeth in the chamfered section, so as to generate an edge rounding of a second magnitude, greater than the first magnitude, at the primary cutting edge of each tooth in the subset.

A polishing system based on a non-Newtonian fluid and a polishing method thereof are provided. The polishing system includes a polishing device, a non-Newtonian fluid auxiliary device and a control device. The polishing device is able to move a work piece in a polishing container containing the non-Newtonian fluid with abrasives that cause the polishing action. The non-Newtonian fluid auxiliary device is able to manipulate the viscosity of the non-Newtonian fluid by varying the pressure, speed, vibration or ultrasonic frequency, which causes the abrasives to polish the work piece. The control device is used to optimize the polishing process by controlling how the polishing device moves the work piece inside the polishing container. In this way, by using the polishing method, the polishing system provided is able to polish a work piece with any three-dimensional shape.

A fixture is provided for retaining a metal workpiece for contact by finishing media during operation of a media based finishing operation. The fixture comprises a body and a magnet for retaining the workpiece in contact with the body. By use of super-magnetic materials a significant holding force may be achieved.

A fixture assembly includes a frame with a tip rail displaced from a main body. A method of polishing a gas turbine engine component includes restricting a flow of media adjacent to a tip of a component with an airfoil to be generally equal to a flow of media adjacent to a sidewall of the airfoil.

Disclosed is an electrochemical polishing method employing solid electro-conductive media with bi-directional planetary motion, mainly including the following steps: using solid particles absorbing an electrolyte as solid electro-conductive media, and submerging an anode (workpiece) in the solid electro-conductive media to perform bi-directional planetary motion during polishing, allowing the workpiece to fully contact and collide with the solid electro-conductive media, and ensuring that materials are uniformly removed from various surfaces of the workpiece. In the present disclosure, one-time overall polishing of complex-shaped workpieces can be achieved by bi-directional planetary motion of the workpieces, the consistency of material removal from various surfaces of the workpieces is improved, and the polishing performance and efficiency are enhanced.

A displacement magnifying mechanism, polishing device, actuator, electronic component processing apparatus, dispenser, and air valve which can easily control a drive system. The displacement magnifying mechanism includes a base; a piezoelectric element of which an end is attached to a mounting surface of the base, the piezoelectric element extending along a first longitudinal direction; a support member of which an end is attached to the mounting surface side by side with the piezoelectric element, the support member extending along a second longitudinal direction which intersects with the first longitudinal direction; an operating portion attached to each of other ends of the piezoelectric element and the support member to allow the operating portion to be displaced, in response to an expansion/contraction of the piezoelectric element, along a displacement direction; and a compression member attached to the base and the operating portion so as to compress the piezoelectric element.