An embodiment of an apparatus includes a centrifugal drive unit, an arm assembly, an optional dynamic balancing ring, and a workpiece fixture. The arm assembly is operatively connected to the centrifugal drive unit and configured to revolve about a primary axis perpendicular to the arm. The workpiece fixture is mounted to the arm assembly, and is configured to rotate at least one workpiece about at least one secondary axis outboard of the primary axis.

An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be subjected to the polishing process, said mechanical workpieces (4) being clamped to said working plane (3) by clamping means (5), said apparatus further comprising vibration generating means (6) cooperating with resilient components (7) adapted to transmit a vibration motion and amplify the action of said vibrating means (6), said apparatus (1) comprising furthermore a closed loop distributing system for distributing a mixture (8) containing a polishing and buffing cleansing material and a micro-abrading material, said mixture (8) being fed within said mechanical workpieces (4) together with metal bodies (9) having a ball shape and a different size and mass, adapted to move and stir said mixture (8) against the inner walls of the cavity of said mechanical workpieces (4) being processed.

Various examples are provided for hybrid tools including fixed-abrasive and loose- abrasive phases. In one example, a hybrid tool for finishing an internal surface of a workpiece includes a metallic rod and magnetic abrasive bonded to one or more defined portions of the metallic rod by an adhesive that dissolves when n contact with a lubricant used to finish the internal surface of the workpiece. In another example, a method for finishing an internal surface of a workpiece includes mounting the workpiece in a chuck of a lathe; positioning a hybrid tool inside an internal cavity of the workpiece using one or more pole-tips; providing an amount of the lubricant to the internal cavity; and rotating the workpiece with the lathe while controlling positioning of the hybrid tool inside the internal cavity using the one or more pole-types.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 in.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A method of additive manufacturing includes additively forming a workpiece. The workpiece defines an interior passage therethrough with a passage surface. Additively forming the workpiece includes additively forming a beam running through the interior passage spaced apart from the passage surface. The method also includes surface treating the passage surface using abrasive flow machining wherein an abrasive flow machining fluid is forced to flow between the beam and the passage surface. The beam can be removed from the workpiece after surface treating the passage surface.

Disclosed herein is a method for inner surface finishing of a workpiece, in which the inner surface of the workpiece defines an opening with axial symmetry around the longitudinal axis of the workpiece. The method may include the following steps. An abrasive medium may be poured inside the opening; urging the abrasive medium to rotate about the longitudinal axis, thereby imposing a centrifugal force on the abrasive medium to accelerate the abrasive medium outwards from the center of rotation towards the inner surface of the opening, where the abrasive medium impacts the inner surface of the opening; and the workpiece may be rotated about the longitudinal axis in a direction opposite the first direction, concurrently.

A multi-fields assisted abrasive scouring polishing method and device. The device includes an abrasive pool, a heating device, an ultrasonic device, a peristaltic pump and a clamping table. In use, first, magnetic poles are installed on a longitudinal rod of a workbench, and the internal channel of the workpiece is communicated with the pump inlet hose. Second, polishing slurry and abrasive particles are added into the abrasive pool, the heating end of the heating device and the vibrating end of the ultrasonic device are immersed into the polishing slurry, and the heating device and the ultrasonic device are started. Finally, a magnetic field device is energized and magnetized, and the peristaltic pump is started to polish the internal channel. The device solves the problems of poor surface quality and low polishing efficiency of a complex long and thin internal channel in a machine part containing an internal channel.

A polishing device and a polishing method. The polishing device includes a thrust system, a sealing system including a piston, a cylinder body matched with the piston, and the cylinder body accommodating a polishing medium for polishing; a conveying pipeline system conveys the polishing medium to one end of an inner flow channel workpiece for polishing; a recycle system including a recycle container, a recycle pipeline, a return pipeline, a driving assembly, and a control valve assembly, the control valve assembly includes a first valve, a second valve; the recycle container is connected with the workpiece through the recycle pipeline, and the sealing system is communicated with the workpiece through the return pipeline; the first valve is coordinated with the sealing system and a low-pressure environment, the second valve is located at the return pipeline, is coordinated with the recycle container and the sealing system.