A water jet strengthening and polishing integrated system for blades of a blisk includes a vibration polishing unit and a water jet strengthening unit. The vibration polishing unit includes a vibration polishing bath, the vibration polishing bath is internally provided with a clamp for clamping the blisk, and vibration motors for driving the vibration polishing bath to vibrate are installed on the vibration polishing bath. Top ends of support springs are fixedly connected with the vibration polishing bath, and bottom ends of the support springs are fixedly connected with a workbench. The water jet strengthening unit includes a water jet strengthening device for carrying out water jet strengthening on the blades of the blisk and a driving mechanism for clamping the water jet strengthening device and capable of driving the water jet strengthening device to move in any direction in space.

An embodiment comprises a container to include a substrate during processing (e.g., centrifugal or vibratory processing) and protect the substrate from other substrates (e.g., medical implants) that are simultaneously being processed and/or from the polishing environment (e.g. vibratory tub sidewalls) during processing. Other embodiments are described herein.

A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.

A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.

An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be subjected to the polishing process, said mechanical workpieces (4) being clamped to said working plane (3) by clamping means (5), said apparatus further comprising vibration generating means (6) cooperating with resilient components (7) adapted to transmit a vibration motion and amplify the action of said vibrating means (6), said apparatus (1) comprising furthermore a closed loop distributing system for distributing a mixture (8) containing a polishing and buffing cleansing material and a micro-abrading material, said mixture (8) being fed within said mechanical workpieces (4) together with metal bodies (9) having a ball shape and a different size and mass, adapted to move and stir said mixture (8) against the inner walls of the cavity of said mechanical workpieces (4) being processed.

An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be subjected to the polishing process, said mechanical workpieces (4) being clamped to said working plane (3) by clamping means (5), said apparatus further comprising vibration generating means (6) cooperating with resilient components (7) adapted to transmit a vibration motion and amplify the action of said vibrating means (6), said apparatus (1) comprising furthermore a closed loop distributing system for distributing a mixture (8) containing a polishing and buffing cleansing material and a micro-abrading material, said mixture (8) being fed within said mechanical workpieces (4) together with metal bodies (9) having a ball shape and a different size and mass, adapted to move and stir said mixture (8) against the inner walls of the cavity of said mechanical workpieces (4) being processed.

A vibropeening apparatus comprises a main frame, an enclosure receivable within the main frame, a rotary drive mechanism, and an article to be vibropeened. The enclosure defines an internal volume, the internal volume accommodating a vibropeening bed. The article is positioned within the internal volume, and the rotary drive mechanism is to configured to impart a rotary motion to the enclosure within the main frame.

A polishing device includes a processing vessel into which workpieces are charged, a fluidizing unit that fluidizes the workpieces in the processing vessel, an abrasive-feeding unit that feeds an abrasive into the workpieces, and a suction unit that generates an air flow in a direction in which the abrasive passes through the processing vessel, and recovers the abrasive by suction. The abrasive fed from the abrasive-feeding unit is allowed to pass between the workpieces charged into the processing vessel by the air flow generated from the suction unit while coming into contact with the workpieces. Accordingly, the workpieces are polished.

A polishing device includes a processing vessel into which workpieces are charged, a fluidizing unit that fluidizes the workpieces in the processing vessel, an abrasive-feeding unit that feeds an abrasive into the workpieces, and a suction unit that generates an air flow in a direction in which the abrasive passes through the processing vessel, and recovers the abrasive by suction. The abrasive fed from the abrasive-feeding unit is allowed to pass between the workpieces charged into the processing vessel by the air flow generated from the suction unit while coming into contact with the workpieces. Accordingly, the workpieces are polished.

A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.