Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

An apparatus for rotating a seat relative to ball in a valve lapping machine includes a seat spindle assembly, an airbag assembly with a first and a second airbag, and a linear compensator affixed to a frame of the seat spindle assembly and to the seat tooling adapter plate. The airbag assembly is adapted to apply contact force between the seat and the ball. The linear compensator has a top plate, middle plate and a bottom plate. A first set of rails extends in a first direction so as to allow movement between the top plate and the middle plate, while a second set of rails which extends in a second direction perpendicular to the first direction allow movement of the bottom plate relative to the middle plate. A ball valve lapping machine utilizing this apparatus is also provided.

An apparatus for rotating a seat relative to ball in a valve lapping machine includes a seat spindle assembly, an airbag assembly with a first and a second airbag, and a linear compensator affixed to a frame of the seat spindle assembly and to the seat tooling adapter plate. The airbag assembly is adapted to apply contact force between the seat and the ball. The linear compensator has a top plate, middle plate and a bottom plate. A first set of rails extends in a first direction so as to allow movement between the top plate and the middle plate, while a second set of rails which extends in a second direction perpendicular to the first direction allow movement of the bottom plate relative to the middle plate. A ball valve lapping machine utilizing this apparatus is also provided.

A rotor polishing device, including a housing with a space therein for holding rotors in need of polishing, an inlet for pumping a polishing lapper into the housing, and a rotational assembly for rotating the rotors during the polishing process. The rotor polishing device is useful for polishing rotors commonly used by rotary screw compression systems.

A rotor polishing device, including a housing with a space therein for holding rotors in need of polishing, an inlet for pumping a polishing lapper into the housing, and a rotational assembly for rotating the rotors during the polishing process. The rotor polishing device is useful for polishing rotors commonly used by rotary screw compression systems.

An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the edge of the substrate and is configured to contact the retaining ring during substrate processing. The extension provides a repeatable and controlled point of contact between the retaining ring and the chucking membrane. The extension may have multiple configurations, such that the contact point between the retaining ring and the chucking membrane is set at a pre-determined location or such that the contact point is moveable by an adjustable stop.

An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the edge of the substrate and is configured to contact the retaining ring during substrate processing. The extension provides a repeatable and controlled point of contact between the retaining ring and the chucking membrane. The extension may have multiple configurations, such that the contact point between the retaining ring and the chucking membrane is set at a pre-determined location or such that the contact point is moveable by an adjustable stop.

A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

Disclosed is a grinding disk kit for finishing rolling surfaces of bearing rollers, including a pair of coaxial first and second grinding disks; a front face of the first grinding disk includes a group of radially distributed linear grooves and transition faces for connecting the adjacent linear grooves; a front face of the second grinding disk includes one or more helical grooves and transition faces for connecting adjacent helical grooves; one bearing roller to be machined is distributed in each linear groove corresponding to each intersection of the helical grooves and the linear grooves during grinding machining; the rolling surfaces of the bearing rollers to be machined are respectively in contact with working faces of the linear grooves and the helical grooves corresponding to each intersection; and the bearing rollers to be machined translate along the linear grooves while rotating about the own axes under the friction.

Various examples are provided for polishing techniques for flexible tubular workpieces. In one example, a method includes supporting a tubular workpiece on a rod that extends axially through it; positioning a turning wheel against an external surface of the tubular workpiece, where it is held by magnetic attraction; and rotating the tubular workpiece by rotating the turning wheel. The external surface of the tubular workpiece is polished by the abrasive particles during rotation of the tubular workpiece. In another example, a polishing system includes a workpiece holder including a rod configured to axially support a tubular workpiece; a turning wheel with abrasive particles distributed about an outer surface; a wheel support assembly configured to position the outer surface of the turning wheel against the an external surface of the tubular workpiece, where it is held by magnetic attraction. The external surface is polished during rotation of the tubular workpiece.