An integrated equipment for processing a plurality of fiber optic ferrules comprises a polishing system, a ferrule cleaning system, a drying system, a wiping system, and a robot system. The polishing system polishes a plurality of front end faces of the plurality of fiber optic ferrules mounted on a carrier. The ferrule cleaning system cleans the carrier and the fiber optic ferrules on the carrier after the fiber optic ferrules have been polished. The drying system dries the carrier and the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been cleaned. The wiping system wipes the front end faces of the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been dried. The robot system transfers the carrier to the polishing system, the ferrule cleaning system, the drying system, and the wiping system.

Among all the materials available on earth, diamond has demonstrated outstanding properties for general-purpose applications. Nevertheless, due to the total lack of processability, artificial diamonds have never captured large industrial markets for the recognized performance. However, theoretical chemists recently paid attention to an old but highly efficient way of producing new facets on gem diamonds by manual self-abrasion. They found by using molecular dynamics calculations that the rate-determining step in the self-abrasion sp.sup.3-sp.sup.2 order-disorder transition on the crystal surface. The product of such a transition is an amorphous layer, which chemically decomposes to produce a new facet. Taking advantage of the self-abrasion mechanism thus found, we designed a novel spheroidization method and experimental apparatuses, wherein the self-abrasion works preferentially on mechanically weak portions like vertices and edges but hardly on stronger surfaces. Spherical diamonds lack self-aggregation properties, are resistant against shocks, have mechanically strong surface and offer a new material.

Among all the materials available on earth, diamond has demonstrated outstanding properties for general-purpose applications. Nevertheless, due to the total lack of processability, artificial diamonds have never captured large industrial markets for the recognized performance. However, theoretical chemists recently paid attention to an old but highly efficient way of producing new facets on gem diamonds by manual self-abrasion. They found by using molecular dynamics calculations that the rate-determining step in the self-abrasion sp.sup.3-sp.sup.2 order-disorder transition on the crystal surface. The product of such a transition is an amorphous layer, which chemically decomposes to produce a new facet. Taking advantage of the self-abrasion mechanism thus found, we designed a novel spheroidization method and experimental apparatuses, wherein the self-abrasion works preferentially on mechanically weak portions like vertices and edges but hardly on stronger surfaces. Spherical diamonds lack self-aggregation properties, are resistant against shocks, have mechanically strong surface and offer a new material.

An automated bore finishing process particularly adapted for lapping automatically corrects one or more bore parameters, such as diameter, geometry, surface finish, in an iterative manner to reach a final value, controlled by algorithms that process feedback from a measurement process. The process determines bore parameter information and determines an optimum set of values for the process parameters, such as stroke position, stroke length and duration of the next lapping iteration. This optimization is targeted to achieve the desired final bore parameter or parameters within the specified bore size limits, and may be used to alter the stroke profile either for the entire next iteration or in a continuously changing manner, to minimize or eliminate bore defects over one or a succession of iterations.

An automated bore finishing process particularly adapted for lapping automatically corrects one or more bore parameters, such as diameter, geometry, surface finish, in an iterative manner to reach a final value, controlled by algorithms that process feedback from a measurement process. The process determines bore parameter information and determines an optimum set of values for the process parameters, such as stroke position, stroke length and duration of the next lapping iteration. This optimization is targeted to achieve the desired final bore parameter or parameters within the specified bore size limits, and may be used to alter the stroke profile either for the entire next iteration or in a continuously changing manner, to minimize or eliminate bore defects over one or a succession of iterations.

A mirror-finishing chamfer polishing is applied using an abrasive-grain-free polishing solution to a chamfered portion of a semiconductor wafer having an oxide film on a top side or the top and bottom sides of the semiconductor wafer and having no oxide film on the chamfered portion. Further, prior to the mirror-finishing chamfer polishing, a pre-finish mirror chamfer polishing is applied using an abrasive-grain-containing polishing solution to the chamfered portion of the semiconductor wafer having the oxide film on the top side or the top and bottom sides and on the chamfered portion.

A mirror-finishing chamfer polishing is applied using an abrasive-grain-free polishing solution to a chamfered portion of a semiconductor wafer having an oxide film on a top side or the top and bottom sides of the semiconductor wafer and having no oxide film on the chamfered portion. Further, prior to the mirror-finishing chamfer polishing, a pre-finish mirror chamfer polishing is applied using an abrasive-grain-containing polishing solution to the chamfered portion of the semiconductor wafer having the oxide film on the top side or the top and bottom sides and on the chamfered portion.

A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component includes: (i) adding a solvent to the abrasive slurry; (ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to collect the abrasive, in which the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive.

An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.

An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.