A bore finishing tool has an arbor with a tapered outer circumferential surface and a sleeve over the arbor having a tapered inner circumferential surface cooperatively disposed in surface to surface overlaying relation to at least a substantial portion of the tapered outer circumferential surface of the arbor. The sleeve is adjustably movable relative to the arbor for expanding a diametrical extent of the sleeve and has a plurality of internal material relief features at circumferentially spaced locations in the tapered inner circumferential surface extending partially through the sleeve so as to reduce a level of force required for expanding the diametrical extent of the sleeve. Exemplary material relief features include flutes and fractures. The sleeve can also include an external retraction feature enabling application of a retraction force by an external device for reducing the diametrical extent.

A bore finishing tool has an arbor with a tapered outer circumferential surface and a sleeve over the arbor having a tapered inner circumferential surface cooperatively disposed in surface to surface overlaying relation to at least a substantial portion of the tapered outer circumferential surface of the arbor. The sleeve is adjustably movable relative to the arbor for expanding a diametrical extent of the sleeve and has a plurality of internal material relief features at circumferentially spaced locations in the tapered inner circumferential surface extending partially through the sleeve so as to reduce a level of force required for expanding the diametrical extent of the sleeve. Exemplary material relief features include flutes and fractures. The sleeve can also include an external retraction feature enabling application of a retraction force by an external device for reducing the diametrical extent.

A lapping system for lapping portions of a workpiece. The lapping system includes, a lap that is defined by a surface. Portions of the surface are a lapping surface. The lapping surface has a coating that enhances material removal from a workpiece in a lapping process. The lapping system further includes, a scanning probe microscope having a tip and a substrate. The scanning probe microscope controls lapping motion of the lap and workpiece.

A lapping system for lapping portions of a workpiece. The lapping system includes, a lap that is defined by a surface. Portions of the surface are a lapping surface. The lapping surface has a coating that enhances material removal from a workpiece in a lapping process. The lapping system further includes, a scanning probe microscope having a tip and a substrate. The scanning probe microscope controls lapping motion of the lap and workpiece.

A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.

A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

Abrasives, a polishing composition, and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m.sup.2/g or more and 50 m.sup.2/g or less and an average secondary particle diameter of 0.05 μm or more and 4.8 μm or less. This polishing composition can be used for polishing an outer surface of the resin coating.

A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad (10) includes a structure (40, 50) including a polishing surface (30) formed of a hard resin layer (40), the structure (40, 50) allowing the polishing surface (30) to follow a curved surface of a polishing target (90).