A reinforcement ring can be placed in a carrier head to abut an inner surface of a perimeter portion of a flexible membrane. The reinforcement ring has a substantially vertical cylindrical portion, a flange projecting outwardly from the bottom of the cylindrical portion, and a lip projecting outwardly from a top of the cylindrical portion. The flange projects outwardly farther than the lip.

Provided is an optical fiber ferrule polishing jig capable of fixing an optical fiber ferrule and releasing the optical fiber ferrule. An optical fiber ferrule polishing jig 10A has; a base 12a having insertion holes 20 into which optical fiber ferrules 51 can be detachably inserted; pivoting rods 13 which are adjacent to the insertion holes 20 of the base 12a and rotatable around lower end portions 36; fixing pieces 14a installed in installation recesses 19a formed in the base 12a to fix the optical fiber ferrules 51 with respect to the insertion holes 20 by being moved as the rods are pivoted; and a plurality of coil springs 15a installed in the installation recesses 19a to bias the fixing pieces 14a so as to release fixing of the optical fiber ferrules 51 with respect to the insertion holes 20.

Provided is an optical fiber ferrule polishing jig capable of fixing an optical fiber ferrule and releasing the optical fiber ferrule. An optical fiber ferrule polishing jig 10A has; a base 12a having insertion holes 20 into which optical fiber ferrules 51 can be detachably inserted; pivoting rods 13 which are adjacent to the insertion holes 20 of the base 12a and rotatable around lower end portions 36; fixing pieces 14a installed in installation recesses 19a formed in the base 12a to fix the optical fiber ferrules 51 with respect to the insertion holes 20 by being moved as the rods are pivoted; and a plurality of coil springs 15a installed in the installation recesses 19a to bias the fixing pieces 14a so as to release fixing of the optical fiber ferrules 51 with respect to the insertion holes 20.

A method of grinding a workpiece includes a first grinding step of adjusting the relative tilt of a chuck table and a grinding wheel to a first state and bringing grindstones into abrasive contact with the workpiece to grind the workpiece, and a second grinding step of adjusting the relative tilt of the chuck table and the grinding wheel to a second state that is different from the first state and bringing the grindstones into abrasive contact with the workpiece to grind the workpiece. In the second grinding step, the workpiece is ground under a condition for causing the workpiece to have a smaller surface roughness than that in the first grinding step.

A method of grinding a workpiece includes a first grinding step of adjusting the relative tilt of a chuck table and a grinding wheel to a first state and bringing grindstones into abrasive contact with the workpiece to grind the workpiece, and a second grinding step of adjusting the relative tilt of the chuck table and the grinding wheel to a second state that is different from the first state and bringing the grindstones into abrasive contact with the workpiece to grind the workpiece. In the second grinding step, the workpiece is ground under a condition for causing the workpiece to have a smaller surface roughness than that in the first grinding step.

A grinder/polisher comprises a specimen holder, a platen, an actuator configured to move at least one of the specimen holder and the platen, an input device, a machine readable storage device, and a controller. The input device includes a plurality of quick-recall inputs and is configured to receive grinding/polishing parameter inputs representative of grinding/polishing parameters, The grinding/polishing parameters comprise at least two of a cycle time, a platen speed, a specimen speed, a platen direction, a specimen direction, and an applied load. The quick-recall inputs are selectable on a same interface as the user parameter inputs. The controller is configured to save to the machine readable storage device a plurality of user-selected grinding/polishing parameters based on inputs received by the input device, associate the parameters with one of the quick-recall inputs, configure the parameters in response to selection of the quick-recall inputs, and perform an operation according to the parameters.

A grinder/polisher comprises a specimen holder, a platen, an actuator configured to move at least one of the specimen holder and the platen, an input device, a machine readable storage device, and a controller. The input device includes a plurality of quick-recall inputs and is configured to receive grinding/polishing parameter inputs representative of grinding/polishing parameters, The grinding/polishing parameters comprise at least two of a cycle time, a platen speed, a specimen speed, a platen direction, a specimen direction, and an applied load. The quick-recall inputs are selectable on a same interface as the user parameter inputs. The controller is configured to save to the machine readable storage device a plurality of user-selected grinding/polishing parameters based on inputs received by the input device, associate the parameters with one of the quick-recall inputs, configure the parameters in response to selection of the quick-recall inputs, and perform an operation according to the parameters.

A substrate transfer device configured to transfer a substrate while holding a first surface of the substrate by a substrate holder and configured to deliver a second surface of the substrate is provided. The substrate transfer device includes a tilting mechanism configured to perform tilting of the substrate holder when viewed from a side; and a fixing mechanism configured to stop the tilting of the substrate holder when viewed from the side.

A substrate transfer device configured to transfer a substrate while holding a first surface of the substrate by a substrate holder and configured to deliver a second surface of the substrate is provided. The substrate transfer device includes a tilting mechanism configured to perform tilting of the substrate holder when viewed from a side; and a fixing mechanism configured to stop the tilting of the substrate holder when viewed from the side.

A method includes transferring a wafer from a process chamber onto a plurality of robotic fingers outside the process chamber, elevating a wafer chuck until reaching the wafer, applying a first suction force to the wafer using a vacuum hole on the wafer chuck, and applying a second suction force toward the wafer using a porous pipe around the wafer chuck.