A cutting apparatus includes a chuck table for holding a workpiece thereon, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade secured in place on a distal-end portion of a spindle by a mount flange mounted on the distal-end portion of the spindle, an indexing feed unit for moving the cutting unit in indexing feed directions parallel to axial directions of the spindle, a processing feed unit for moving the chuck table in processing feed directions perpendicular to the indexing feed directions, and an end face correction unit for correcting an end face of the mount flange that supports the cutting blade in contact therewith. The processing feed unit includes a table moving base that supports the chuck table thereon and an actuating mechanism for moving the table moving base. The end face correction unit is fixedly mounted on the table moving base.

A grinding wheel is mounted at a distal end of a spindle and grinds a wafer held on a holding table. The grinding wheel includes: an annular base having a mounting surface to be mounted on the distal end of the spindle; and a plurality of segment grindstones that are fixedly attached annularly to a surface opposite to the mounting surface of the annular base and that are equidistantly spaced apart from each other. The annular base has a plurality of slits formed therein. Each of the slits represents a gap that is formed between two adjacent segment grindstones and that is extended toward a side of the annular base such that the slit has a width of the gap.

The present disclosure relates to a grinding head for a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a grinding head comprises a lower casing member, comprising a lower support and an upwardly extending edge portion, and an upper casing member, comprising an upper cover and a downwardly extending edge portion, wherein the upper casing member is joinable to the lower casing member by causing axially distal portions of the edge portions to bear on each other.

A setup platform is provided for a grinder including a cutoff wheel. The setup platform includes an upper planar surface including a first edge, which may be shaped similar to the grinder housing, the first edge including a slot therein for receiving the cutoff wheel. An anchor bar is mounted horizontally to the grinder housing, and a post extending from a lower surface of the setup platform is slidable on the anchor bar such that the setup platform is slidable relative to the anchor bar to removably mount the setup platform to the grinder such that the first edge is disposed adjacent the grinder housing and the cutoff wheel is received in the slot.

A tool for ultrasonic impact grinding apparatus driven to vibrate along a longitudinal axis at an applied operating frequency includes a tool body disposed on the longitudinal axis, a first tip extending from an output end of the tool body, and a second tip extending in parallel to the first tip from the output end of the tool body. The first tip has a first length. The second tip has a second length greater than the first length. A mass of the first and second tip is substantially balanced across the output end of the tool body and with respect to the longitudinal axis.

A carrier head for a chemical mechanical polishing apparatus comprises: a base; a substrate receiving member comprising a plate portion having an outer surface for receiving a substrate and an inner surface at the back of the outer surface, a perimeter portion extended in a height direction from an edge of the plate portion, a securing portion extended from an outer part of the perimeter portion and connected to a lower part of the base, and a contact portion extended from an inner part of the perimeter portion; a contact coupling structure connected to the lower part of the base to provide a contact surface to the contact portion; and a perimeter portion pressurizing chamber formed by taking the securing portion and the contact portion as chamber walls when the contact portion contacts firmly the contact coupling structure by means of fluid pressure.

An example trimming tool includes a floating base having a first side and an opposite, second side, a first rail, and a second rail. At least the second side of the floating base, the first rail and the second rail define a workspace having a first opening and a second opening. The trimming tool also includes a milling apparatus, attached to the floating base, having a base on the first side of the floating base and a milling head on the second side of the floating base. The milling head is spring loaded. The floating base and milling apparatus are configured to remove at least a portion of a foam layer in the workspace.

A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.

A polishing apparatus according to the present embodiment includes a head, a polishing table, a rotation table, a particle supplier, and one chamber. The head holds an object. The polishing table polishes a polishing target surface of the polishing target object. The rotation table is capable of contacting the polishing target surface. The particle supplier supplies slurry containing particles onto the rotation table so that the particles are fixed onto at least part of the polishing target surface, while the polishing target surface is contacting the rotation table. The one chamber houses the polishing table and the rotation table.

A machining apparatus machines an end face of a tapered roller with a grinding wheel. The machining apparatus includes a support mechanism configured to support the tapered roller, a wheel unit on which the grinding wheel is mounted, and a base configured to support the wheel unit so that the wheel unit is swivelable about a center line in a vertical direction. A machining point where the grinding wheel is brought into contact with the end face of the tapered roller supported by the support mechanism is located on an extension of the center line serving as a swivel center of the wheel unit.