An embodiment sanding device includes a housing mountable on an arm of a robot, a sanding tool assembly rotatably installed on the housing by a spindle shaft, and a sanding pressure regulating unit coaxially connected to the spindle shaft and configured to regulate sanding pressure of the sanding tool assembly applied to a coating film while reciprocating the spindle shaft in an axial direction.

A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.

A carrier head for a chemical mechanical polishing apparatus comprises: a base; a substrate receiving member comprising a plate portion having an outer surface for receiving a substrate and an inner surface at the back of the outer surface, a perimeter portion extended in a height direction from an edge of the plate portion, a securing portion extended from an outer part of the perimeter portion and connected to a lower part of the base, and a contact portion extended from an inner part of the perimeter portion; a contact coupling structure connected to the lower part of the base to provide a contact surface to the contact portion; and a perimeter portion pressurizing chamber formed by taking the securing portion and the contact portion as chamber walls when the contact portion contacts firmly the contact coupling structure by means of fluid pressure.

An adjustable stroke device for a random orbital machine has a housing with a central axis and a wall defining a cavity. At least one counterweight is movably disposed at least partially within the cavity. A mounting assembly is disposed at least partially within the cavity. The mounting assembly has a workpiece attachment mechanism. A stroke adjuster couples the at least one counterweight with the mounting assembly. The stroke adjuster enables the at least one counterweight and mounting assembly to move with respect to one another such that a distance between the at least one counterweight and the mounting assembly may be variably adjusted which, in turn, variably adjust a stroke radius of the workpiece attachment mechanism with respect to the central axis of the housing. The stroke adjuster has an adjuster ring that engages and disengages the cam mechanism to enable variable adjustment of the stroke distance.

A sanding disc stabilizing structure of an orbital sander comprises a casing, a sanding power source, a sanding disc, and at least four springs. The sanding power source is assembled on the casing and comprises a drive shaft and a tool holder disposed on the drive shaft and offset from an axis of the drive shaft. The center of the sanding disc driven by the sanding power source to perform an orbital motion is disposed on the tool holder with a locking screw. Two ends of each of the at least four springs are respectively disposed on the casing and the sanding disc. The free length of each of at least four springs is greater than the spacing between an installation part of the casing and an installation part of the sanding disc provided for one of the at least four springs.

A robotic system for modifying a surface is presented. The system includes a motive robot arm with an arm movement mechanism. The system also includes a tool coupled to the arm movement mechanism. The tool is configured to removably couple to an article configured to contact the surface. The system also includes a first actuator that causes the arm movement mechanism to move the tool into a pickup position with respect to the article. The system also includes a second actuator that causes a shearing motion, during an article attachment step, between the article and the tool. The coupling between the article and the tool comprises a hook and loop system.

The disclosed subject matter relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the disclosed subject matter relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head includes an annular elastic member configured to press a polishing tool against the substrate, and a pressing-tool body having a pressing surface configured to press the polishing tool against the substrate via the elastic member, wherein the pressing surface has a first fitting groove in which a first portion of the elastic member fits, the first portion (41) protrudes from the pressing surface, the elastic member is put on the pressing-tool body (43) with the elastic member elastically deformed, and the polishing head is configured to press the polishing tool against the substrate by the first portion.

A polishing apparatus capable of removing a chipping is disclosed. The polishing apparatus includes a first polishing head and a second polishing head. The first polishing head is configured to press a first polishing tool against a peripheral portion of a substrate to form a recess in the peripheral portion. The second polishing head is configured to press a second polishing tool against a polishing boundary of the recess.

An example trimming tool includes a floating base having a first side and an opposite, second side, a first rail, and a second rail. At least the second side of the floating base, the first rail and the second rail define a workspace having a first opening and a second opening. The trimming tool also includes a milling apparatus, attached to the floating base, having a base on the first side of the floating base and a milling head on the second side of the floating base. The milling head is spring loaded. The floating base and milling apparatus are configured to remove at least a portion of a foam layer in the workspace.

A tool for ultrasonic impact grinding apparatus driven to vibrate along a longitudinal axis at an applied operating frequency includes a tool body disposed on the longitudinal axis, a first tip extending from an output end of the tool body, and a second tip extending in parallel to the first tip from the output end of the tool body. The first tip has a first length. The second tip has a second length greater than the first length. A mass of the first and second tip is substantially balanced across the output end of the tool body and with respect to the longitudinal axis.