A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

A cam device includes a drive cam, a follower, a holding cam, and a restriction roller. The drive cam reciprocally rotates. The follower intermittently reciprocate linearly by the drive cam. The holding cam is rotationally driven integrally with the drive cam. The restriction roller is provided on the follower and restricts a movement of the follower by coming in contact with the holding cam. The holding cam separates from the restriction roller and the holding cam is in a holding release state, when the drive cam is in an engaged state with the follower.

Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.

A suction holding table for holding a holdable object under suction includes a base seat rotatable about a rotational axis, and a plurality of holders erected from the base seat and angularly spaced at equal angular intervals along a circle around the rotational axis, in which each of the holders has an upper surface functioning as a holding surface with a suction port defined therein, and attract the holdable object to the holder under a negative pressure applied via the suction port.

A machined wheel post-processing equipment includes a wheel inlet roller way, a lower machine frame, lower guide posts, lower air cylinders, a supporting plate, guide sleeves, a lifting table, guide rails, a clamping cylinder, a left sliding plate, a right sliding plate, a rack and pinion, servomotors, a lifting roller way, clamping wheels, a first servomotor, and a overturning platform.

A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.

A multi-functional wheel deburring device is capable of removing burrs at the center hole, the flange weight reducing socket, the spoke back cavity weight reducing socket and the spoke edge of the wheel during the use.

There is provided a processing method of grinding a workpiece. The processing method includes a holding step of holding the workpiece on a side of its front surface on a chuck table, a coarse grinding step of grinding the workpiece on a side of its back surface with first grinding stones until the workpiece has a predetermined thickness, an auxiliary grinding step of grinding the workpiece on the side of its back surface with the first grinding stones such that an unground region remains at an outer peripheral portion of the workpiece, an unground region grinding step of grinding the unground region with second grinding stones having an average abrasive grain size smaller than that of the first grinding stones, and a finish grinding step of grinding the workpiece on the side of its back surface with the second grinding stones until the workpiece has a predetermined finish thickness.

A processing device with a constant force spindle capable of quickly switching a force control axial direction and a processing method thereof, having a quick-detach unit fixed at a constant force control unit by a first quick-connecting piece, and respectively connecting and moving synchronously with the spindle by a second quick-connecting piece and a third quick-connecting piece, the first quick-connecting piece moves along with a working end of a multi-axial transfer unit, and when combined, a first axial direction that is coaxial with the force control axial direction is defined; alternatively, the first quick-connecting piece moves along with the working end of the multi-axial transfer unit, and when combined, a second axial direction that is coaxial with the force control axial direction is defined, the first axial direction is not parallel to the second axial direction and has an included angle.