A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.

A finishing apparatus includes a workpiece-receiving device, a rotary drive configured to drive a workpiece in rotation about a workpiece axis and an oscillatory drive configured to produce a relative movement between the workpiece and a finishing tool in a direction that is parallel to the workpiece axis. A workpiece-conveying device has a workpiece holder that is moveable by a drive device between a working position in which the workpiece is in position to be machined and a loading/unloading position in which the workpiece is loadable/unloadable. The workpiece holder has a support device configured to support the workpiece. The drive device is formed as a swivel drive such that the workpiece holder is swivelable between the working position and the loading/unloading position along an arcuate swivel path.

To provide an installation for cleaning and/or deburring workpieces, comprising a treatment region configured to enable a cleaning treatment and/or a deburring treatment to be performed on a workpiece therein, a loading device for transferring the workpiece from an outer area of the installation into the treatment region and an unloading device for transferring the workpiece from the treatment region into the outer area of the installation, with which installation there is achieved a high workpiece throughput with a favourable cleaning and/or deburring result, it is proposed that the loading device and/or the unloading device comprises at least one treatment device configured to enable the workpiece to be treated during the transfer between the outer area of the installation and the treatment region of the installation.

While the loading member supporting mechanism moves the loading member from the workpiece set state to the workpiece retracted state and returns to the workpiece set state again, the displacement drive unit and the rotation drive unit perform an operation of disposing the workpiece holding portion arranged at the processing position to the replacement position and an operation of disposing the workpiece holding portion disposed at the replacement position to the processing position in a trajectory in which the loading member does not interfere with the shoe.

A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units each having first support blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units each having second support blocks (215) for compressing downward upper portions of the compression line springs and thus supporting the compression line springs. The grinding units grind seat surfaces formed on opposite ends of the compression line springs that are moved by the upper and lower chain conveyors. A V-shaped depression (115a) is formed in each first support block so that each of the compression line springs is seated onto the corresponding V-shaped depression. A lower surface (215a) of the second support block that compresses the compression line springs has a planar structure.

The invention relates to an apparatus for honing a bore in a workpiece, having an apparatus base, having a turntable arranged on the apparatus base, with a plurality of workpiece receptacles, having at least one loading station for loading and unloading from the workpiece receptacles, having at least one honing station with a horizontal honing unit and with a displacement device for displacing the horizontal honing unit relative to the turntable, and having at least one tool magazine for receiving a plurality of honing spindles.

A cutting apparatus includes a chuck table for holding a workpiece thereon, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade secured in place on a distal-end portion of a spindle by a mount flange mounted on the distal-end portion of the spindle, an indexing feed unit for moving the cutting unit in indexing feed directions parallel to axial directions of the spindle, a processing feed unit for moving the chuck table in processing feed directions perpendicular to the indexing feed directions, and an end face correction unit for correcting an end face of the mount flange that supports the cutting blade in contact therewith. The processing feed unit includes a table moving base that supports the chuck table thereon and an actuating mechanism for moving the table moving base. The end face correction unit is fixedly mounted on the table moving base.

The present disclosure provides an automatic processing apparatus including a main body, a receiving portion, a working assembly, a workpiece magazine, a setting mechanism, a passivation bucket assembly, and a rotation driving assembly. The receiving portion is adapted for receiving a plurality of workpieces. The setting mechanism takes the workpieces to the receiving portion from the workpiece magazine. The working assembly is adapted for bringing the workpieces to the passivation bucket assembly for processing. The passivation bucket assembly includes a turning table and a plurality of passivation buckets moving when the turning table rotates. The rotation driving assembly drives one of the passivation buckets to rotate. Thereby, automatic processing can be achieved by the apparatus of the present invention, and the efficiency of processing is improved too.

A polishing machine with an automatic feed and discharge function includes a machine frame, a clamping mechanism, a polishing shaft, a feed mechanism and a discharge mechanism. The clamping mechanism, the discharge mechanism, the polishing shaft and the feed mechanism are mounted on the machine frame. Multiple polishing heads are mounted on the polishing shaft. The feed mechanism includes a feed frame, a sliding platform, a sliding drive member, multiple columns of storage mechanisms for storing polishing pads, and multiple columns of push mechanisms, and the number of the columns of the storage mechanisms matches the number of the columns of the push mechanisms. The feed frame is mounted on the machine frame. The sliding platform is slidably arranged on the feed frame. The storage mechanisms are mounted on the sliding platform. The push mechanisms are mounted on the feed frame and are located above the storage mechanisms.