A tool for chamfering cleaved tips of optical fibers. The tool including conical bores of relatively smooth and hard material terminate at a cylindrical bore that is slightly larger than the fiber core maximum diameter and a fiber centering bore that is slightly larger than the fiber coating maximum diameter. The tool provided such that when a cleaved fiber tip is inserted into the centering bore the sharp edge falls upon the chamfering surface that, when rotated relative to the fiber, gently grinds the edge to the chamfer angle. Chamfering cannot occur on the core face due to the absence of tool surface at this dimension.

A grinder tool with blind mounting of a disc includes a center alignment mechanism having a first contact and a second contact and a rotational device including an axle that is movable with respect to the center alignment mechanism. A hub is mounted to the axle including a first coupling interface. The disc has a second coupling interface for mating with the first coupling interface. The center alignment mechanism is movable a mounting distance relative to the hub and contacts the disc with the first contact and the second contact to center align the first coupling interface with the second coupling interface. The rotational device is to slowly rotate the hub to angle align the first coupling interface with the second coupling interface to allow the disc to mate and attach to the hub.

A management method of a machining system includes a chuck table, a machining unit, a transfer unit that transfers a wafer onto the chuck table, a camera unit that acquires an image containing a pattern formed on a side of a front surface of the wafer, and an information recording section. The management method is applied when the pattern is recorded in association with machining conditions in the information recording section; and records in the information recording section new machining conditions to be used when machining a new type of wafer, causes an automatic machining program, which automatically machines the new type of wafer, to start, forms an image, which contains a new pattern of the new type of wafer, by the camera unit, and records the new pattern in association with the new machining conditions in the information recording section.

The present invention discloses an industrial high speed micro drill that is made to access remote and inaccessible locations in order to blend, grind, polish and cut materials and parts as determined by visual inspection powered via a pneumatic power source. The high speed drill is deployed by a controlled, articulating guide tube that acts in a multidirectional fashion to direct the action of the assemblage and allow for discrete manipulation of the pneumatically powered drill while harboring a channel and pneumatic power source carrying rubber tubing.

The present disclosure discloses a device for cutting connection of multi-piece module electrode which includes a stand, the stand is provided with a workbench and the workbench is connected with a height adjusting device. The device further includes an angle grinding device, the angle grinding device includes a polishing shaft and an angle grinder, the angle grinder is arranged on the polishing shaft, and the angle grinding device is provided with a saw blade. According to the characteristics of the module electrode, the angle grinding device is matched with the workbench to implement simultaneous electrode disconnecting operation of multiple electrodes of the module, so that the device not only has higher efficiency and better cutting effect, but also is suitable for universal saw blades, saves the cost, and is safer.

A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.

A grinding machine includes a machine bed on which a workpiece spindle with a workpiece holder and a tool spindle with a tool holder are arranged. A workpiece held in the workpiece spindle, relative to a tool held in the tool holder, is displaceable along an X-axis running in a first direction parallel to the surface of the machine bed, is displaceable along a Y-axis, running in a second direction parallel to the surface of the machine bed, is displaceable along a Z-axis running perpendicular to the surface of the machine bed, is rotatable about an A-axis running parallel to the surface of the machine bed, and is rotatable about a C-axis running perpendicular to the surface of the machine bed. The tool spindle is completely kinematically separated from the workpiece spindle. Movements along the X-axis, about the A-axis and about the C-axis being carried out by the workpiece spindle.

A honing machine for machining workpieces that have at least one bore to be machined by means of honing, comprises a plurality of workstations (180-1, 180-2), wherein at least one of the workstations is configured as a honing station (180-1, 180-2) that comprises at least one honing unit (150-1, 150-2) that has a spindle shaft (152) that is rotatable about a vertical spindle axis (155) by means of a rotary drive and is movable back and forth parallel to the spindle axis by means of a reciprocating drive. The honing machine has a pallet transport system (200) internal to the machine, for transporting workpieces from and to the workstations (180-1, 180-2) by means of pallets (210-1, 210-2). The pallet transport system (200) is designed such that different transport paths are freely configurable via a control unit (190) of the honing machine (200).

A grinding apparatus includes: a pair of rotary grindstones, a rotary base rotationally driven around a first rotation axis, a rotary table included in the rotary base, a fixed base rotatably supporting the rotary base, a fixed table included in the fixed base, a plurality of workpiece supporting tables supported on the rotary base and rotationally driven around a second rotation axis, a plurality of workpiece receiving holes vertically passing through an outer edge part of the workpiece supporting tables, a first motor fixed to the fixed base to rotationally drive the rotary table, a plurality of second motors fixed to the rotary base to rotationally drive the workpiece supporting tables, a controller driving the first motor and the plurality of second motors, and a slip ring disposed below the plurality of second motors and conductively connecting between the controller and the plurality of second motors.

The present disclosure discloses an integrated rotary cutting tool manufacturing device and method, the integrated rotary cutting tool manufacturing device comprises a workpiece transfer device, a machine body, a feeding device, grinding devices and a discharge device. The grinding devices comprise a rough grinding device used for carrying out primary grinding on a vertically arranged workpiece and a fine grinding device used for carrying out secondary grinding on the vertically arranged workpiece. The integrated rotary cutting tool manufacturing device is adopted by the rotary cutting tool manufacturing method. The device according to the present disclosure is compact in structure, high in machining efficiency and precision, and low in costs, the maximum values, the minimum values and the average values of the roundness and the concentricity of machined micro drill bits are closer to the standard values, and the stabilization process capability indexes of the roundness.