The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.

Disclosed is a device for removing burrs from an aluminum alloy hub. The device includes a workbench, columns, a brush, a spindle, a spindle box, a cross beam, a spindle motor, a controller, a parallel robot, and a displacement sensor. Columns are fixedly connected to the workbench, and the cross beam is connected to the columns and a position of the cross beam can be adjusted along the columns; the spindle box is connected to the cross beam, and moves horizontally on the cross beam; the spindle, the spindle motor and the controller are mounted on the spindle box, and the brush is mounted at the end of the spindle; the brush is driven to rotate by the spindle motor and controlled by the controller; and the displacement sensor is mounted in the brush. The parallel robot can implement precise adjustment, and can perform real-time posture adjustment according to the instruction of the controller to ensure that the brush is always in close contact with the back cavity of the hub.

An underwater polishing system according to the present disclosure includes a tank, a robot, and a polishing machine. In a state where a workpiece held by an arm portion of the robot, at least a part of a second rotating roller and at least a part of a polishing tool of the polishing machine are immersed in a liquid stored in the tank, the held workpiece is polished by operating the arm portion of the robot and pressing the held workpiece against the polishing tool.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A double disc surface grinding machine includes a clamp band which has a non-circular outer circumferential portion. The clamp band is attached to an outer circumferential surface of a work and is housed, under the attached state, in a storage portion which has a non-circular inner circumferential portion engageable with the outer circumferential portion of the clamp band, movably in a first direction. A rotation drive unit rotates the storage portion around a first rotation shaft extending in the first direction, to make the inner circumferential portion of the storage portion engage with the outer circumferential portion of the clamp band, thereby rotates the clamp band and the work together with the storage portion. At least one of the grinding wheels is fed onto the work so as to sandwich the work with a pair of rotating grinding wheels for grinding two main surfaces of the work.

The invention discloses a caliper repairing clamp, which relates to the technical field of calipers and comprises a machine body, wherein a polishing disc is arranged inside the machine body, a protective cover is arranged on the outer surface of the polishing disc, a moving table is arranged below the machine body, a polishing table is arranged above the moving table, a fixed table is fixedly connected to the upper surface of the polishing table, a first bearing is fixedly embedded inside the machine body, a rotating handle is arranged below the moving table, and a first threaded rod is fixedly connected to the upper surface of the rotating handle.

A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.

A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a compressed gas stream, a mixer coupled to the source and the compressor to mix the dry ice particles with the compressed gas stream to form a stream of compressed gas with entrained dry ice particles, and a nozzle coupled to the mixer to direct the stream of compressed gas with entrained dry ice particles onto a polishing surface of the polishing pad at sufficient velocity to condition the polishing pad.

A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.