A waterjet system in accordance with at least some embodiments includes a carriage, a motion assembly configured to move the carriage horizontally relative to a workpiece, and a cutting head carried by the carriage. The waterjet system can also include a kinematic chain through which the cutting head is operably connected to the carriage. The kinematic chain can include first, second, and third joints rotatably adjustable about different first, second, and third axes, respectively. The carriage and the first and second joints can be configured to move the cutting head along a path relative to the workpiece while the cutting head directs a jet toward the workpiece to form a product. The third joint can be configured to shift a kinematic singularity away from the path to reduce or eliminate delay and corresponding reduced cutting accuracy associated with approaching the kinematic singularity.

A waterjet system in accordance with at least some embodiments includes a carriage, a motion assembly configured to move the carriage horizontally relative to a workpiece, and a cutting head carried by the carriage. The waterjet system can also include a kinematic chain through which the cutting head is operably connected to the carriage. The kinematic chain can include first, second, and third joints rotatably adjustable about different first, second, and third axes, respectively. The carriage and the first and second joints can be configured to move the cutting head along a path relative to the workpiece while the cutting head directs a jet toward the workpiece to form a product. The third joint can be configured to shift a kinematic singularity away from the path to reduce or eliminate delay and corresponding reduced cutting accuracy associated with approaching the kinematic singularity.

A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.

A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.

A processing apparatus for brittle plate includes a table which holds a brittle plate, a processing head having a processing wheel for processing an outer peripheral edge of the brittle plate held by the table, a measuring portion which measures a positional shift amount Δ in an axis direction of the processing wheel with respect to the brittle plate, and a control portion which corrects a positional shift in a Z-axis direction of the processing wheel on the basis of a positional shift amount Δ in the axis direction of the processing wheel measured by the measuring portion and causes the processing wheel whose positional shift was corrected to process the outer peripheral edge of the brittle plate. The processing apparatus and its method can reduce time and labor of manually positioning of a processing wheel to the brittle plate after processing wheel replacement.

A machine tool includes a bed including a bottom surface and legs arranged at three positions of the bottom surface. The bed includes two oblique sides arranged such that the bottom surface has a triangular shape. The machine tool also includes a first support surface arranged on the bed and extending along a substantially horizontal first axis, a work table supported by the first support surface so as to move along the first axis, a second support surface arranged on the bed and extending along a substantially horizontal second axis, which is perpendicular to the first axis, and a machining unit supported by the second support surface so as to move along the second axis. The second support surface is located higher than the first support surface.

A machine tool includes a bed including a bottom surface and legs arranged at three positions of the bottom surface. The bed includes two oblique sides arranged such that the bottom surface has a triangular shape. The machine tool also includes a first support surface arranged on the bed and extending along a substantially horizontal first axis, a work table supported by the first support surface so as to move along the first axis, a second support surface arranged on the bed and extending along a substantially horizontal second axis, which is perpendicular to the first axis, and a machining unit supported by the second support surface so as to move along the second axis. The second support surface is located higher than the first support surface.

Polishing systems and methods are described. An exemplar polishing system includes: (i) a jig designed to secure mobile device; (ii) a polishing head designed to contact and polish a mobile device surface; (iii) a spindle disposed above the jig and fitted with the polishing head; (iv) a slurry dispenser arranged adjacent to the spindle and designed to store and dispense polishing slurry on the mobile device surface; and (v) a central controller programmed to control operation of the jig, the spindle, and the slurry dispenser such that during an operative state of the jig and the spindle, and under control of the central controller, the slurry dispenser dispenses polishing slurry to facilitate polishing of the mobile device surface.

Polishing systems and methods are described. An exemplar polishing system includes: (i) a jig designed to secure mobile device; (ii) a polishing head designed to contact and polish a mobile device surface; (iii) a spindle disposed above the jig and fitted with the polishing head; (iv) a slurry dispenser arranged adjacent to the spindle and designed to store and dispense polishing slurry on the mobile device surface; and (v) a central controller programmed to control operation of the jig, the spindle, and the slurry dispenser such that during an operative state of the jig and the spindle, and under control of the central controller, the slurry dispenser dispenses polishing slurry to facilitate polishing of the mobile device surface.

A grinding device of a travel path, on which traveling wheels of a rail-type vehicle roll, includes a grinder which grinds a surface layer of a travel path, a frame on which the grinder is provided, and a device traveling wheel mounted on the frame. The device traveling wheel rolls along the travel path on the top surface of the standard rail extending in the extending direction of the travel path.