A polishing equipment for a spherical body is provided, including: a base, including a tubular member configure to support the spherical body to be polished; a fluid pressurizing unit, being in communication with an interior of the tubular member and configure for fluid to flow into the interior of the tubular member to push the spherical body; a grinding member, configured to be relatively movable with respect to the tubular member, and configured for grinding an outer surface of the spherical body and rotating the spherical body by friction.

A polishing equipment for a spherical body is provided, including: a base, including a tubular member configure to support the spherical body to be polished; a fluid pressurizing unit, being in communication with an interior of the tubular member and configure for fluid to flow into the interior of the tubular member to push the spherical body; a grinding member, configured to be relatively movable with respect to the tubular member, and configured for grinding an outer surface of the spherical body and rotating the spherical body by friction.

A precision squeegee grinder including a grinder assembly configured to grind an edge of a squeegee blade, a squeegee mounting assembly configured to hold the squeegee blade, a grinder assembly vertically alignable with respect to the squeegee mounting assembly, a latitudinal movement assembly connected to the grinder assembly, the latitudinal movement assembly configured to position the grinder assembly with respect to the squeegee blade in defined increments, a longitudinal movement assembly connected to the latitudinal movement, the longitudinal movement assembly configured to move the grinder assembly along a width of the squeegee blade, and a base assembly. The grinder assembly, the squeegee mounting assembly, the latitudinal movement assembly, and the longitudinal movement assembly are connected to the base assembly. The squeegee mounting assembly, the latitudinal movement assembly, and the longitudinal movement assembly enable triaxial alignment between the grinder assembly and the squeegee blade.

A method of manufacturing a wafer holder, the wafer holder having a frame having at least one cavity capable of receiving and supporting a wafer grown from an ingot to be polished in a polishing machine, the at least one cavity having a cross sectional footprint at least equal to a cross sectional footprint of the wafer, the wafer having a thickness to cross sectional area ratio of 0.001 per unit length or less, a polymer film pad being permanently affixed in the at least one cavity, including cutting a frame from a layer of a thermoset or thermoplastic material having a thickness tolerance and measuring a thickness of the frame at at least one location thereon. The method further includes forming a cavity in the frame having a predetermined depth, and permanently affixing a polymer film pad in the cavity.

A method of manufacturing a wafer holder, the wafer holder having a frame having at least one cavity capable of receiving and supporting a wafer grown from an ingot to be polished in a polishing machine, the at least one cavity having a cross sectional footprint at least equal to a cross sectional footprint of the wafer, the wafer having a thickness to cross sectional area ratio of 0.001 per unit length or less, a polymer film pad being permanently affixed in the at least one cavity, including cutting a frame from a layer of a thermoset or thermoplastic material having a thickness tolerance and measuring a thickness of the frame at at least one location thereon. The method further includes forming a cavity in the frame having a predetermined depth, and permanently affixing a polymer film pad in the cavity.

A tire grinding machine includes a frame having a plurality of vertically extending posts. A chuck assembly is associated with the frame and adapted to receive and rotate a tire. A grinding assembly is associated with the frame and is movable with respect to the frame. The grinding assembly has at least one grinding element adapted to contact and remove material from the tire when rotated by the chuck assembly. A counterbalance assembly which has a cable with one end connected to a counterbalance weight and an opposite end connected to the grinding assembly is included. A block assembly may be coupled to the grinding assembly to allow pivotable movement thereof. A calibration adapter may be used to ensure proper positioning of the grinding elements, wherein a level adjuster may be used for this purpose.

The present invention relates to a device (14) for sanding floor areas, the device comprising a frame, a steering, a motor which is provided to said frame, a subframe (13) rotatably coupled with said motor, said subframe being centrally provided with an adapter (7) along the lower side, a sanding frame (1), said sanding frame being centrally provided with a receiver (2) along the upper side, said receiver receiving said adapter, and at least one holder (5) for sanding elements, said holder being provided along the lower side of said sanding frame and being suitable for the attachment of sanding elements (15). In particular, the subframe is freely supported by the sanding frame, via said adapter and receiver, said adapter and receiver being rotationally coupled. In other aspects, the invention relates to a sanding frame, a sanding element and a method for sanding floor areas, as well as a floor area obtained by application of said method.

A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

A radius adjustment apparatus includes a yoke assembly having a yoke body defining a threaded inner channel and a threaded yoke adjuster rod situated in the inner channel, the threads meshing together such that the yoke body is moved forwardly or rearwardly upon rotation of the adjuster rod. The adjuster rod is actuated by an attached adjuster knob. The yoke includes a pair of yoke arms each having a proximal end coupled to the yoke body and a distal end coupled to opposed ends of a bearing arm, the bearing arm extending between the distal ends. The bearing arm may be flexed or arched about a midpoint attachment fastener. A carriage, which may be coupled to a traditional grinding machine, is slidably coupled to the bearing rail for manual movement therealong. Slidable movement along the flexed or arched bearing rail causes a workpiece to receive a spherical or circular grind.