The grinding disc receptacle has a rotationally symmetrical, hollow-cylindrical receptacle main body. A through-pipe, which is braced in particular in relation to the receptacle main body, is disposed in the cavity of the receptacle main body so as to be spaced apart from the cylinder barrel of the hollow-cylindrical receptacle main body.

The grinding disc receptacle has a rotationally symmetrical, hollow-cylindrical receptacle main body. A through-pipe, which is braced in particular in relation to the receptacle main body, is disposed in the cavity of the receptacle main body so as to be spaced apart from the cylinder barrel of the hollow-cylindrical receptacle main body.

A floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method are disclosed, an X-axis moving platform, a Y-axis moving platform, a Z-axis moving platform and a workpiece swinging platform in linkage control ensure normal lines of a tool and a workpiece are kept at an identical angle to realize sub-aperture processing; the ventilation main shaft acts air pressure on the ball spline's end portion to form an axial thrust to let the tool axially float; a dynamic balance among hydrodynamic pressure, air pressure and dynamic pressure is performed on the polishing liquid by rotation of the flexible tool; a tiny gap between the tool and workpiece is formed by elastic deformation of the flexible tool due to the dynamic pressure; a shearing force for removing materials is generated when the polishing liquid flows through the gap; a cavitation effect in the gap is formed by ultrasonic waves.

A floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method are disclosed, an X-axis moving platform, a Y-axis moving platform, a Z-axis moving platform and a workpiece swinging platform in linkage control ensure normal lines of a tool and a workpiece are kept at an identical angle to realize sub-aperture processing; the ventilation main shaft acts air pressure on the ball spline's end portion to form an axial thrust to let the tool axially float; a dynamic balance among hydrodynamic pressure, air pressure and dynamic pressure is performed on the polishing liquid by rotation of the flexible tool; a tiny gap between the tool and workpiece is formed by elastic deformation of the flexible tool due to the dynamic pressure; a shearing force for removing materials is generated when the polishing liquid flows through the gap; a cavitation effect in the gap is formed by ultrasonic waves.

A belt sander includes a frame, a drive roller, an idler roller rotatably attached to a pivot arm, a first linear actuator configured for pivoting the pivot arm, a nose roller and a continuous abrasive belt wrapped around the drive roller, the idler roller and the nose roller. A drive motor rotates the drive roller, and an air cylinder attached to the frame and a nose roller spindle exerts a first force against the frame and a second force equal to and opposite the first force against the nose roller spindle. A first sensor senses a position of a belt edge, and a first controller receives a belt edge position signal from the first sensor and sends a command signal responsive to the position signal to the first linear actuator for expanding or contracting so as to pivot the pivot arm about a pivot point.

A belt sander includes a frame, a drive roller, an idler roller rotatably attached to a pivot arm, a first linear actuator configured for pivoting the pivot arm, a nose roller and a continuous abrasive belt wrapped around the drive roller, the idler roller and the nose roller. A drive motor rotates the drive roller, and an air cylinder attached to the frame and a nose roller spindle exerts a first force against the frame and a second force equal to and opposite the first force against the nose roller spindle. A first sensor senses a position of a belt edge, and a first controller receives a belt edge position signal from the first sensor and sends a command signal responsive to the position signal to the first linear actuator for expanding or contracting so as to pivot the pivot arm about a pivot point.

A sanding disc stabilizing structure of an orbital sander comprises a casing, a sanding power source, a sanding disc, and at least four springs. The sanding power source is assembled on the casing and comprises a drive shaft and a tool holder disposed on the drive shaft and offset from an axis of the drive shaft. The center of the sanding disc driven by the sanding power source to perform an orbital motion is disposed on the tool holder with a locking screw. Two ends of each of the at least four springs are respectively disposed on the casing and the sanding disc. The free length of each of at least four springs is greater than the spacing between an installation part of the casing and an installation part of the sanding disc provided for one of the at least four springs.

A grinding apparatus acquires a ground-off quantity of a wafer that is being ground, by subtracting a vertical length |(H0−H1)| by which grindstones are worn that is acquired by an upper surface height measuring instrument that is selectively lifted and lowered in unison with a grinding mechanism from a distance |(Z0−Z1)| by which the grinding mechanism is lowered that is acquired by a Z-axis encoder coupled with the grinding mechanism. Since the ground-off quantity of the wafer is acquired using the upper surface height measuring instrument and the Z-axis encoder, it is not necessary to determine the ground-off quantity of the wafer with use of only an upper surface height measuring instrument disposed on a foundation, as has been customary heretofore.

A grinding apparatus acquires a ground-off quantity of a wafer that is being ground, by subtracting a vertical length |(H0−H1)| by which grindstones are worn that is acquired by an upper surface height measuring instrument that is selectively lifted and lowered in unison with a grinding mechanism from a distance |(Z0−Z1)| by which the grinding mechanism is lowered that is acquired by a Z-axis encoder coupled with the grinding mechanism. Since the ground-off quantity of the wafer is acquired using the upper surface height measuring instrument and the Z-axis encoder, it is not necessary to determine the ground-off quantity of the wafer with use of only an upper surface height measuring instrument disposed on a foundation, as has been customary heretofore.

Workpiece holder (3) for coupling a workpiece (2) provided with reference surfaces (30) to a machining device (200) for manufacturing a rotational-symmetrical tool (1) with at least one geometrically defined cutting edge (10), the workpiece holder (3) comprises a machine part (31) configured to be connectable to the machining device (200) in a releasable rotationally fixed manner, a clamping part (32) configured to receive and clamp the workpiece (2) in a releasable manner. The clamping part (32) of the workpiece holder (3) comprises at least one slot (40) provided at a circumference thereof and configured to provide access to the reference surfaces (30) of the clamped workpiece (2) therethrough.