A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.

A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.

A workpiece centering gauge for a grinding machine includes a link having a first pivot configured to couple with the grinding machine; a first encoder that measures an angle of the link at the first pivot; a second pivot included with the link; a measuring fork configured to releasably contact an outer surface of an elongated workpiece; a surface feeler, having a transducer, included with the measuring fork that measures a workpiece diameter a second encoder that measures an angular position of the link relative to the measuring fork; the angular position measured by the first encoder, the angular position measured by the second encoder, and a measured workpiece diameter are used to determine a deviation of the elongated workpiece from a centerline.

The present invention provides an end face polishing device capable of improving a polishing accuracy by polishing an end face of an optical fiber ferrule with adjusted polishing pressure. An end face polishing device 1 for optical fiber ferrule for polishing an end face of an optical fiber ferrule by applying a polishing pressure between a polishing plate 5 driven by a polishing drive shaft and an optical fiber ferrule held by a holding portion 9. The end face polishing device for optical fiber ferrule has: a bearing portion for allowing the polishing plate 5 to rotate relatively around the polishing drive shaft and to move relatively to the polishing drive shaft in an axial direction; a polishing plate guide supporting portion 31 for movably supporting the polishing plate 5 on a base portion 3 to apply the polishing pressure to the holding portion 9 by allowing the polishing plate 5 to move in the axial direction; a pressing drive source 15 for adjustably outputting a driving force to apply the polishing pressure; and a pressing force transmission mechanism 21 for transmitting the driving force output from the pressing drive source 15 as a pressing force in the axial movement direction of the polishing plate 5.

The present invention provides an end face polishing device capable of improving a polishing accuracy by polishing an end face of an optical fiber ferrule with adjusted polishing pressure. An end face polishing device 1 for optical fiber ferrule for polishing an end face of an optical fiber ferrule by applying a polishing pressure between a polishing plate 5 driven by a polishing drive shaft and an optical fiber ferrule held by a holding portion 9. The end face polishing device for optical fiber ferrule has: a bearing portion for allowing the polishing plate 5 to rotate relatively around the polishing drive shaft and to move relatively to the polishing drive shaft in an axial direction; a polishing plate guide supporting portion 31 for movably supporting the polishing plate 5 on a base portion 3 to apply the polishing pressure to the holding portion 9 by allowing the polishing plate 5 to move in the axial direction; a pressing drive source 15 for adjustably outputting a driving force to apply the polishing pressure; and a pressing force transmission mechanism 21 for transmitting the driving force output from the pressing drive source 15 as a pressing force in the axial movement direction of the polishing plate 5.

A multi-functional wheel deburring device is capable of removing burrs at the center hole, the flange weight reducing socket, the spoke back cavity weight reducing socket and the spoke edge of the wheel during the use.

A multi-functional wheel deburring device is capable of removing burrs at the center hole, the flange weight reducing socket, the spoke back cavity weight reducing socket and the spoke edge of the wheel during the use.

A NMQL grinding device of ultrasonic vibration assists grinding fluid micro-channel infiltration, and solves the problem that nanofluids are difficult to fully infiltrate the grinding zone in the prior art. Fully considers the impact of thickness of undeformed grinding debris on the grinding process and the lubrication state of single grains during material removal in the grinding process, the advantage of ultrasonic vibration assistance on improving the lubri-cooling performance of NMQL grinding is effectively achieved. According to the solution, the device includes an ultrasonic vibration mechanism capable of adjusting the spatial position of ultrasonic vibrators, the mechanism being arranged on a worktable; a NMQL grinding mechanism, arranged above a workpiece fixing table; and a grinding force measuring mechanism, including a dynamometer and a grinding force controller connected with the dynamometer, the dynamometer being arranged at the bottom of the ultrasonic vibration mechanism.

A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the substrate supported by the table in a center direction of the table to position the substrate. The at least three centering mechanisms each include a rotation shaft arranged in a peripheral area of the table and a centering member mounted to the rotation shaft.

A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the substrate supported by the table in a center direction of the table to position the substrate. The at least three centering mechanisms each include a rotation shaft arranged in a peripheral area of the table and a centering member mounted to the rotation shaft.