A device for repairing burrs of an electrode plate is provided, which includes a plurality of shaping rollers, wherein a shaping surface is formed on an outer surface of each of the shaping rollers, and along a conveying direction of an electrode plate, included angles between the plurality of shaping surfaces and a surface of the electrode plate decrease in sequence. The device for repairing burrs of an electrode plate gradually decreases the angle between the burrs and the electrode plate until the burrs are flattened, and the end-surface burrs are finally transformed into flat-surface burrs, thereby reducing the safety risk of batteries.

A device for repairing burrs of an electrode plate is provided, which includes a plurality of shaping rollers, wherein a shaping surface is formed on an outer surface of each of the shaping rollers, and along a conveying direction of an electrode plate, included angles between the plurality of shaping surfaces and a surface of the electrode plate decrease in sequence. The device for repairing burrs of an electrode plate gradually decreases the angle between the burrs and the electrode plate until the burrs are flattened, and the end-surface burrs are finally transformed into flat-surface burrs, thereby reducing the safety risk of batteries.

A controllable magnetic field-assisted finishing apparatus for an inner surface and a finishing method are provided. The apparatus includes a housing, ball screw mechanisms, a workpiece, a centering clamp, a connecting plate, a magnetic field generating device, a chuck clamp, a precise displacement platform and a base. The magnetic field generating device includes electromagnetic coils, coil connecting plates, a magnetic yoke, nuts, springs and bolts. The magnetic field generating device dynamically adjusts a distance from the magnetic yoke to the outer surface of the workpiece through the springs. The movement tracks of the magnetic finishing medium are controlled by the formed rotation of the magnetic field, the finishing action force dynamic-adjustment, the optimization of the machining form of the magnetic finishing medium in collaboration with the rotation of the chuck clamp and the feed movement of the precise displacement platform.

A controllable magnetic field-assisted finishing apparatus for an inner surface and a finishing method are provided. The apparatus includes a housing, ball screw mechanisms, a workpiece, a centering clamp, a connecting plate, a magnetic field generating device, a chuck clamp, a precise displacement platform and a base. The magnetic field generating device includes electromagnetic coils, coil connecting plates, a magnetic yoke, nuts, springs and bolts. The magnetic field generating device dynamically adjusts a distance from the magnetic yoke to the outer surface of the workpiece through the springs. The movement tracks of the magnetic finishing medium are controlled by the formed rotation of the magnetic field, the finishing action force dynamic-adjustment, the optimization of the machining form of the magnetic finishing medium in collaboration with the rotation of the chuck clamp and the feed movement of the precise displacement platform.

An elastic emission machining apparatus includes a machining element having a non-spherical shape that is configured to spin about an axis of rotation, a tank, and a driving system. The tank has a chamber positioned to receive the machining element and a slurry comprising a mixture of a liquid and chemically reactive fine particles. The driving system is coupled to and configured to engage the machining element to spin about the axis of rotation adjacent to a surface of the workpiece to accelerate the chemically reactive fine particles through a gap between the machining element and the surface of the workpiece.

An elastic emission machining apparatus includes a machining element having a non-spherical shape that is configured to spin about an axis of rotation, a tank, and a driving system. The tank has a chamber positioned to receive the machining element and a slurry comprising a mixture of a liquid and chemically reactive fine particles. The driving system is coupled to and configured to engage the machining element to spin about the axis of rotation adjacent to a surface of the workpiece to accelerate the chemically reactive fine particles through a gap between the machining element and the surface of the workpiece.

A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular doss section and a plurality endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of to the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular doss section and a plurality endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of to the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a wafer, and a first grinding feed unit and a second grinding feed unit that execute grinding feed of them. Each grinding feed unit has a pair of guides parallel to the grinding feed direction and a ball screw. The grinding area of each grinding unit has a circular arc shape in which one end exists at the outer circumference of the wafer and the other end exists at the center of the wafer.

Methods and systems are described herein for surface treatment operations using an autonomous sander system (system). The system may include a drive system operatively coupled to a chassis, so that the drive system is able to propel the autonomous sander system across a workpiece. The system may include a processor coupled to the autonomous sander system and area-monitoring sensors so that the processor may direct the system to perform a sanding operation based on information gathered from the surrounding environment by the sensors. The system performs the sanding operation by obtaining a surface treatment command that includes a threshold condition; obtaining workpiece assessment data from the sensors based on the command; directing the system to execute the sanding operation; directing the drive system to propel the sander along a desired path; and terminating the operation if a threshold condition is met.