A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Disclosed is a method implemented by a computer, for determining the position of an optical lens member having a surface placed on a lens blocking ring, the blocking ring including a bearing zone arranged to bear at least partially a placed known surface of the optical lens member when the known surface of the optical lens member is placed on the lens blocking ring and hold by a force applied on the optical lens member, the method includes finding a trio of points of the bearing zone that forms a triangle including the projection on the main plane of the point of application of the force; and a position of the optical lens having a virtual contact between the placed known surface and the ring at the location of the trios of points.

Disclosed is a method implemented by a computer, for determining the position of an optical lens member having a surface placed on a lens blocking ring, the blocking ring including a bearing zone arranged to bear at least partially a placed known surface of the optical lens member when the known surface of the optical lens member is placed on the lens blocking ring and hold by a force applied on the optical lens member, the method includes finding a trio of points of the bearing zone that forms a triangle including the projection on the main plane of the point of application of the force; and a position of the optical lens having a virtual contact between the placed known surface and the ring at the location of the trios of points.

The invention relates to a grinding and/or erosion machine (10), as well as to a method for gauging and referencing the axis arrangement (11) comprising several machine axes (12), wherein each can be configured as a rotational or translational machine axis. To do so, a measuring disk (28) is inserted in a tool spindle (13) and a test mandrel (27) is inserted in a workpiece holding device (14). The test mandrel (27) is electrically connected to a reference potential, preferably ground (M). The measuring disk (28) is electrically connected to a supply voltage potential (UV). By forming a contact between the measuring disk (28) and the test mandrel (27), a measuring current (IM) flows between the supply voltage potential (UV) and the reference potential and, in accordance with the example, from the supply voltage potential (UV) to ground (M). The flow of this measuring current (IM) may be detected in a monitoring device (31), and the actual position of the machine axes (12) at the time of the start of the current flow of the measuring current (IM) can be determined. Via the axis arrangement (11), one or more contact locations (K) between the measuring disk (28) and the test mandrel (27) can be approached, and, as a result of this, referencing or gauging of the axis arrangement (11) and the machine, respectively, can take place.

The invention relates to a grinding and/or erosion machine (10), as well as to a method for gauging and referencing the axis arrangement (11) comprising several machine axes (12), wherein each can be configured as a rotational or translational machine axis. To do so, a measuring disk (28) is inserted in a tool spindle (13) and a test mandrel (27) is inserted in a workpiece holding device (14). The test mandrel (27) is electrically connected to a reference potential, preferably ground (M). The measuring disk (28) is electrically connected to a supply voltage potential (UV). By forming a contact between the measuring disk (28) and the test mandrel (27), a measuring current (IM) flows between the supply voltage potential (UV) and the reference potential and, in accordance with the example, from the supply voltage potential (UV) to ground (M). The flow of this measuring current (IM) may be detected in a monitoring device (31), and the actual position of the machine axes (12) at the time of the start of the current flow of the measuring current (IM) can be determined. Via the axis arrangement (11), one or more contact locations (K) between the measuring disk (28) and the test mandrel (27) can be approached, and, as a result of this, referencing or gauging of the axis arrangement (11) and the machine, respectively, can take place.

The present invention is a novel system with a cutting tool and a probe, said probe configured to measure surface features, and generate a plurality of data points including a computer with a program configured for input and output of data wherein said input is at least one probe measured data point; a computer generated averaging data point, and a computer plus manually adjusted data point and provides an operator the option to select and switch during a single cutting operation between a computer-controlled movement of said cutting tool and a manual controlled movement of said cutting tool.

The present invention is a novel system with a cutting tool and a probe, said probe configured to measure surface features, and generate a plurality of data points including a computer with a program configured for input and output of data wherein said input is at least one probe measured data point; a computer generated averaging data point, and a computer plus manually adjusted data point and provides an operator the option to select and switch during a single cutting operation between a computer-controlled movement of said cutting tool and a manual controlled movement of said cutting tool.

The invention relates to a centerless cylindrical grinding machine (100) for throughfeed and plunge grinding of arbitrary workpieces comprising a first drivable positioning axis X.sub.S for a grinding headstock (10) with a grinding wheel (11) rotatable about an axis of rotation (12) and a second drivable positioning axis X.sub.R for a regulating wheel headstock (20) with a regulating wheel (21) rotatable about an axis of rotation (22), and a workpiece support (32) arrangeable substantially between the grinding headstock (10) and the regulating wheel headstock (20), wherein a further drivable positioning axis Y.sub.W, extending orthogonal to at least one of the positioning axes X.sub.S and X.sub.R, is mounted for a carriage (31) on a carriage track (30), via which the workpiece support (32) is movable, wherein the grinding headstock (10) and the regulating wheel headstock (20) are arranged in a first area (41) of a machine bed (40) and the carriage track (30) is at least partially arranged in a second area (42) of the machine bed (40), wherein the second area (42) of the machine bed (40) has a lesser extension in a direction parallel to the positioning axis Y.sub.W than the first area (41) of the machine bed (40).

A glass-plate working apparatus 1 includes: a scribe line forming device 5, glass-plate bend-breaking devices 15A and 15B, glass-plate peripheral edge grinding devices 19A and 19B, and a glass-plate transporting device 20 for carrying in and carrying out two glass plates 2 at a time with respect to each of the scribe line forming device 5, the glass-plate bend-breaking devices 15A and 15B, and the glass-plate peripheral edge grinding devices 19A and 19B, and X-Y coordinate system controlled movement of the glass-plate peripheral edge grinding devices 19A and 19B in simultaneous grinding of peripheral edges of the glass plates 2 is adapted to be effected independently of each other.

A glass-plate working apparatus 1 includes: a scribe line forming device 5, glass-plate bend-breaking devices 15A and 15B, glass-plate peripheral edge grinding devices 19A and 19B, and a glass-plate transporting device 20 for carrying in and carrying out two glass plates 2 at a time with respect to each of the scribe line forming device 5, the glass-plate bend-breaking devices 15A and 15B, and the glass-plate peripheral edge grinding devices 19A and 19B, and X-Y coordinate system controlled movement of the glass-plate peripheral edge grinding devices 19A and 19B in simultaneous grinding of peripheral edges of the glass plates 2 is adapted to be effected independently of each other.