A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.

A multi-axis polishing apparatus includes a machine body, a multi-axis transmission device, and an abrasive container set. The multi-axis transmission device, movably mounted onto a main vertical column in a machine body that can move in an insertion direction, includes a driving module and a plurality of shaft assemblies connected transmissively to the driving module. The plurality of shaft assemblies is used to mount a plurality of workpieces, respectively. The abrasive container set, located below the multi-axis transmission device, is filled with abrasive materials. The multi-axis transmission device moves in the insertion direction to position the plurality of shaft assemblies as well as the plurality of workpieces downward into the abrasive container set, and then the driving module rotates the plurality of shaft assemblies and the plurality of workpieces to utilize the abrasive materials to polish the plurality of workpieces.

A multi-axis polishing apparatus includes a machine body, a multi-axis transmission device, and an abrasive container set. The multi-axis transmission device, movably mounted onto a main vertical column in a machine body that can move in an insertion direction, includes a driving module and a plurality of shaft assemblies connected transmissively to the driving module. The plurality of shaft assemblies is used to mount a plurality of workpieces, respectively. The abrasive container set, located below the multi-axis transmission device, is filled with abrasive materials. The multi-axis transmission device moves in the insertion direction to position the plurality of shaft assemblies as well as the plurality of workpieces downward into the abrasive container set, and then the driving module rotates the plurality of shaft assemblies and the plurality of workpieces to utilize the abrasive materials to polish the plurality of workpieces.

The present invention belongs to the technical field of polishing machinery, and particularly relates to a full-automatic polishing machine aiming at the valve core head of a snort valve. The full-automatic polishing machine comprises a base, and a material taking device, a fixture and a polishing device which are provided on the base, wherein the material taking device comprises mechanical arms, and a first driving mechanism for driving the mechanical arms to move in transverse and vertical directions; and the polishing device comprises a grinding wheel, a second driving mechanism for driving the grinding wheel to rotate, and a third driving mechanism for driving the grinding wheel to move in longitudinal and vertical directions. By adopting the full-automatic polishing machine, automatic polishing of the valve core head of the snort valve is realized, plenty of manpower is saved, the working efficiency is improved, and a polished product is unified in quality, and thus being favorable for the large-scale production and export of the valve core heads.

A grinding stroke control device for a valve stem grinding apparatus is fixed to a processing machine and provided for gripping a valve stem or a test bar. Using the hand wheel, the dial gauge and the positioning seat can obtain an initial position, then moving the measuring meter of the positioning mechanism along the transverse direction to make sure the valve stem has the right length with a standard valve clearance. By such arrangements, the grinding stroke control device for a stem valve grinding apparatus of the invention can have a less complicated structure and therefore is more convenient to operate.

A grinding stroke control device for a valve stem grinding apparatus is fixed to a processing machine and provided for gripping a valve stem or a test bar. Using the hand wheel, the dial gauge and the positioning seat can obtain an initial position, then moving the measuring meter of the positioning mechanism along the transverse direction to make sure the valve stem has the right length with a standard valve clearance. By such arrangements, the grinding stroke control device for a stem valve grinding apparatus of the invention can have a less complicated structure and therefore is more convenient to operate.

The present application disclose a wheel blank positioning end face correction device, comprising a frame, a servo motor I, a support frame, a bearing seat, a bearing, a shaft, a rotating platform, a guide rail, a cylinder, a left slide plate, a left bearing seat, a left shaft, a left bearing, a left driven grooved friction wheel, a left workbench, corner cylinder pressure claws, mandrel seats, mandrels, a grinding wheel, a grinding wheel drive motor, a support plate, a feeding slide plate, feeding guide rails, a linear motor, a distance measuring sensor, a fixed plate, a servo motor II, a driving grooved friction wheel, a right workbench, a right driven grooved friction wheel, a right shaft, a gear rack structure and a right slide plate.

The present application disclose a wheel blank positioning end face correction device, comprising a frame, a servo motor I, a support frame, a bearing seat, a bearing, a shaft, a rotating platform, a guide rail, a cylinder, a left slide plate, a left bearing seat, a left shaft, a left bearing, a left driven grooved friction wheel, a left workbench, corner cylinder pressure claws, mandrel seats, mandrels, a grinding wheel, a grinding wheel drive motor, a support plate, a feeding slide plate, feeding guide rails, a linear motor, a distance measuring sensor, a fixed plate, a servo motor II, a driving grooved friction wheel, a right workbench, a right driven grooved friction wheel, a right shaft, a gear rack structure and a right slide plate.

A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.