Patent classifications
B24B47/22
Method for machining a surface of an optical lens
Methods of determining movement data representing the movement of a machining tool of an optical lens lathing device for machining one or more optical surfaces or parts thereof of a set of optical surfaces are described. The methods comprise a greatest radial slope amplitude determining step during which the greatest radial slope amplitude of the optical surfaces of the set of optical surfaces is determined. The methods also comprise a machining tool selecting step during which a machining tool having a window angle greater than or equal to the greatest radial slope amplitude of the optical surfaces of the set of surfaces to be manufactured is selected. The methods further comprise a movement data determining step during which movement data representing the movement of the selected machining tool are determined and synchronized with the angular position of the optical surface driven in rotation.
Method for machining a surface of an optical lens
Methods of determining movement data representing the movement of a machining tool of an optical lens lathing device for machining one or more optical surfaces or parts thereof of a set of optical surfaces are described. The methods comprise a greatest radial slope amplitude determining step during which the greatest radial slope amplitude of the optical surfaces of the set of optical surfaces is determined. The methods also comprise a machining tool selecting step during which a machining tool having a window angle greater than or equal to the greatest radial slope amplitude of the optical surfaces of the set of surfaces to be manufactured is selected. The methods further comprise a movement data determining step during which movement data representing the movement of the selected machining tool are determined and synchronized with the angular position of the optical surface driven in rotation.
SYSTEMS FOR AND METHODS OF SURFACING A COMPOSITE LENS BLANK WITH FUNCTIONAL LAYER
Disclosed are systems and processes for generating a finished or semi-finished lens, such as a spectacle lens, from a lens blank that includes an intermediate functional layer. Some embodiments of the process involve locating the functional layer and positioning the lens blank according to the location of the functional layer. The location of the functional layer can be ascertained by measuring the thickness of one or more layers of the lens blank. The lens blank can be surfaced on one or both sides to form a finished or semi-finished lens. Other embodiments are also described.
SYSTEMS FOR AND METHODS OF SURFACING A COMPOSITE LENS BLANK WITH FUNCTIONAL LAYER
Disclosed are systems and processes for generating a finished or semi-finished lens, such as a spectacle lens, from a lens blank that includes an intermediate functional layer. Some embodiments of the process involve locating the functional layer and positioning the lens blank according to the location of the functional layer. The location of the functional layer can be ascertained by measuring the thickness of one or more layers of the lens blank. The lens blank can be surfaced on one or both sides to form a finished or semi-finished lens. Other embodiments are also described.
GLASS-PLATE WORKING APPARATUS
A glass-plate working apparatus 1 includes a feeding section 7, a scribing and bend-breaking section 8, a grinding section 9, and a discharging section 10. The feeding section 7, the scribing and bend-breaking section 8, the grinding section 9, and the discharging section 10 are provided by being arranged from a right end R side toward a left end L side, and the scribing and bend-breaking section 8 is adapted to effect the formation of a scribe line on a glass plate 2 and the bend-breaking and separation of the glass plate 2 along the scribe line in a state in which the glass plate 2 is fixed as it is at the same position.
GLASS-PLATE WORKING APPARATUS
A glass-plate working apparatus 1 includes a feeding section 7, a scribing and bend-breaking section 8, a grinding section 9, and a discharging section 10. The feeding section 7, the scribing and bend-breaking section 8, the grinding section 9, and the discharging section 10 are provided by being arranged from a right end R side toward a left end L side, and the scribing and bend-breaking section 8 is adapted to effect the formation of a scribe line on a glass plate 2 and the bend-breaking and separation of the glass plate 2 along the scribe line in a state in which the glass plate 2 is fixed as it is at the same position.
GLASS-PLATE WORKING APPARATUS
A glass-plate working apparatus 1 includes: a scribe line forming device 5, glass-plate bend-breaking devices 15A and 15B, glass-plate peripheral edge grinding devices 19A and 19B, and a glass-plate transporting device 20 for carrying in and carrying out two glass plates 2 at a time with respect to each of the scribe line forming device 5, the glass-plate bend-breaking devices 15A and 15B, and the glass-plate peripheral edge grinding devices 19A and 19B, and X-Y coordinate system controlled movement of the glass-plate peripheral edge grinding devices 19A and 19B in simultaneous grinding of peripheral edges of the glass plates 2 is adapted to be effected independently of each other.
Polishing apparatus
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
Polishing apparatus
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
Method for taping an optical lens member
Method of taping an optical lens member (10) to be manufactured. An optical lens member providing step (S1) is performed during which an optical lens member (10) is provided, the optical lens member has a first optical surface (11) associated with a first reference system and a second optical surface (12) to be manufactured, the first and second optical surfaces being connected by a external periphery surface (14), the first reference system being identified by at least one referencing element (111) on the first optical surface and/or the external periphery surface of the optical lens member, a taping step (S2) during which an adhesive tape (17) is provided on the first surface of the lens member so as to cover at least part of the first surface and leaving the referencing element uncovered.