The present invention provides a measurement device for grinding wheel. One or more thickness measurement device is disposed slidably on a platform. A spinning device is disposed on the platform. A grinding wheel is fixed on the spinning device. The spinning shaft spins the grinding wheel. The one or more thickness measurement device measures the flatness condition of the grinding wheel. Furthermore, according to the present invention, a diameter measurement device is disposed inside the platform and measures the roundness of the outer periphery of the grinding wheel. Since the structure can be disassembled easily, the whole measurement device for grinding wheel can be carried conveniently. In addition, measurements can be performed by users on the site where the grinding wheel is located for real-timely understanding the real size and wear condition of grinding wheel.

A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.

A grinding machine including one or more grinding wheels has a workpiece holder that releasably holds a crankshaft and is configured to rotate the crankshaft about a longitudinal axis; a spindle assembly, that is moveable in at least two directions, including a spindle shaft and a grinding wheel attached to the spindle shaft; and an acoustic emission sensor coupled to the grinding machine, such that the grinding machine is configured to monitor an output signal from the acoustic emission sensor, move the grinding wheel into contact with the crankshaft at a first angular position, detect contact between the grinding wheel and the crankshaft based on the output signal, determine a position of the grinding wheel based on the detected contact between the grinding wheel and the crankshaft, move the grinding wheel away from the crankshaft, rotate the crankshaft a defined angular amount, move the grinding wheel into contact with the crankshaft at a second angular position, determine a position of the grinding wheel based on the detected contact between the grinding wheel and the crankshaft, and determine a position of a crankshaft surface.

Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing an CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) with a time-alternating force and/or means for measuring an electrical characteristic of the CMP-process. The time-alternating force is applied with the use of a system component that is electrically isolated from the workpiece and that is disposed in the carrier-chick in which the workpiece is affixed for CMP-process, while the electrical characteristic is measured with the use of a judiciously-configured reservoir in which the used fluid is collected. The use of such CMP-apparatus.

A retaining ring for a chemical mechanical polishing carrier head having a mounting surface for a substrate is provided herein. In some embodiments, the retaining ring may include an annular body have a central opening, a channel formed in the body, wherein a first end of the channel is proximate the central opening, and a sensor disposed within the channel and proximate the first end, wherein the sensor is configured to detect acoustic and/or vibration emissions from processes performed on the substrate.

A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.

In a method of operating an apparatus for manufacturing or analyzing semiconductor wafers, sound in a process chamber of the apparatus during an operation of the apparatus is detected. An electrical signal corresponding to the detected sound is acquired by a signal processor. The acquired electrical signal is processed by the signal processor. An event during the operation of the apparatus is detected based on the processed electrical signal. The operation of the apparatus is controlled according to the detected event.

A planarization process can be performed on a moving structure by moving a planarizing pad against the moving structure. A liquid and a gas can be injected into a flow cell integrated in the moving pad to produce a two-phase liquid-gas flow in the flow cell while a surface of the moving structure contacts the two-phase liquid-gas flow. An endpoint of the planarization process can be determined by determining that a characteristic of the two-phase liquid-gas flow changes to a predetermined characteristic.

The present application discloses a single-point diamond dresser for a grinding wheel based on acoustic emission online monitoring, which includes a support module, an anti-interference module, a compression cooling module and an acoustic emission online monitoring module. An acoustic emission sensor monitors the dressing state of the grinding wheel online; a damping sheet and a damping interlayer greatly reduce external noise interference; a high pressure coolant causes an upward elastic deformation of an elastic spacer and the damping sheet, enlarging a contact force between the acoustic emission sensor and the core and moreover improving a sensitivity of the acoustic emission sensor; the coolant flows through the coolant passages in the core to cool a dressing area; current limiting passages, pressure relief cavities and perforated pressure-relief plates limit flow and reduce a pressure of the coolant, reducing the interference of the coolant on the grinding wheel dressing.

A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.