The present application relates to systems and methods for obtaining real-time abrasion data. An example computer-implemented method could include receiving, at a computing device, sensor data from one or more sensors. The one or more sensors are disposed in proximity to an abrasive product or a workpiece associated with the abrasive product. The one or more sensors are configured to collect abrasion operational data associated with an abrasive operation involving the abrasive product or the workpiece. The computer-implemented method could further include training, based on the sensor data, a machine learning system to determine product specific information of the abrasive product and/or workpiece specific information. The computer-implemented method could also include providing the trained machine learning system using the computing device.

A method for controlling polishing and grinding is provided, including: generating an initial polishing and grinding trajectory for robot movements based on a three-dimensional contour of a work piece; adjusting the initial polishing and grinding trajectory based on a first optimized adjustment value and generating an optimized polishing and grinding trajectory; and evaluating the polishing and grinding quality of the work piece and using the polishing and grinding quality to generate a second optimized adjustment value.

The present application relates to systems and methods for obtaining real-time abrasion data. An example system includes a remote sensor that is located remotely from a grinding tool and a workpiece. The remote sensor is configured to detect vibration and/or noise associated with a grinding operation involving the grinding tool and the workpiece. The system includes communication interface and a controller configured to carry out operations. The operations include receiving, from the remote sensor, at least one of vibration or noise information associated with the grinding tool and the workpiece. The operations also include determining tool-specific information or workpiece-specific information based on the at least one of the vibration or noise information. The operations yet further include transmitting, via the communication interface, the tool-specific information or workpiece-specific information. The system also includes a remote computing device configured to receive the transmitted tool-specific information or workpiece-specific information.

The present application discloses a single-point diamond dresser for a grinding wheel based on acoustic emission online monitoring, which includes a support module, an anti-interference module, a compression cooling module and an acoustic emission online monitoring module. An acoustic emission sensor monitors the dressing state of the grinding wheel online; a damping sheet and a damping interlayer greatly reduce external noise interference; a high pressure coolant causes an upward elastic deformation of an elastic spacer and the damping sheet, enlarging a contact force between the acoustic emission sensor and the core and moreover improving a sensitivity of the acoustic emission sensor; the coolant flows through the coolant passages in the core to cool a dressing area; current limiting passages, pressure relief cavities and perforated pressure-relief plates limit flow and reduce a pressure of the coolant, reducing the interference of the coolant on the grinding wheel dressing.

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

The present disclosure describes an apparatus and a method to detect a polishing pad profile during a polish process and adjust the polishing process based on the detected profile. The apparatus can include a polishing pad configured to polishing a substrate, a substrate carrier configured to hold the substrate against the polishing pad, and a detection module configured to detect a profile of the polishing pad. The detection module can include a probe configured to measure a thickness of one or more areas on the polishing pad, and a beam configured to support the probe, where the probe can be further configured to move along the beam.

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Monitoring system (12) for a mobile component (3), for example a rotating component, supported by a stationary component (2). The monitoring system (12) comprises: an acoustic sensor (10) which is positioned in the movable component (3) and comprises two terminals (17); a first amplifier (18) which is positioned in the movable component (3) and has two input terminals and two output terminals; a contactless communication unit (14) provided with a first transceiver device (15) positioned in the mobile component (3) and a second transceiver device (16) which faces the first transceiver device (15) and is positioned in the stationary component (2); a first connection line (19) which connects the sensor (10) to the first amplifier (18) e has two electrical leads each of them connecting a terminal (17) of the acoustic sensor (10) to a corresponding input terminal of the first amplifier (18); and a second connection line (20) which connects the first amplifier (18) to the first transceiver device (15) and has two electrical leads each of them connecting an output terminal of the first amplifier (18) to the first transceiver device (15).

A polishing apparatus includes a polisher that polishes a target object to be polished. A holder is rotatable while holding the target object to be polished. Multiple concentric elastic members around the center of a rotation shaft of the holder are provided on the holder and elastically press the target object to be polished against the polisher. Multiple sensors are provided in the elastic members and detect vibration from a polishing surface of the target object to be polished. The detected vibration allows the polishing apparatus to create an unevenness map of the polishing surface and correspondingly actuate the concentric elastic members to remove the unevenness, according to a control sequence set in advance, based on the detected vibration, in a polishing control program to control the concentric elastic members.

The present disclosure describes a method and apparatus to remove consumable (e.g., sacrificial) polishing pad layers from a multilayer polishing pad. For example, the method includes measuring a thickness profile of a top polishing pad layer of a multilayer polishing pad and comparing the thickness profile to a threshold. The method, in response to the thickness profile being above the threshold, rinses the top polishing pad layer of the multilayer polishing pad and removes, after the top polishing pad layer has been rinsed, the top polishing pad layer to expose an underlying polishing pad layer of the multilayer polishing pad.