An estimation model creating device for grinding wheel surface condition estimation includes a measurement data obtaining unit and a first learning model creating unit. The measurement data obtaining unit obtains measurement data measured during grinding of workpieces with a grinding wheel in a grinding machine. The measurement data obtaining unit obtains the measurement data for a predetermined period of time for each workpiece. The measurement data includes at least one of first measurement data indicating the condition of a structural member of the grinding machine, and second measurement data relating to a ground portion of the workpiece. The first learning model creating unit performs machine learning using the measurement data relating to the workpieces as first-learning input data so as to create a first learning model for estimating a surface condition of the grinding wheel.

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use.

Monitoring system (12) for a mobile component (3), for example a rotating component, supported by a fixed component (2). The monitoring system (12) components: two acoustic sensors (10) which are separate and independent from each other and are positioned in the rotating component (3); two first amplifiers (18) positioned in the rotating component (3); a single contactless communication unit (14) provided with a first transceiver device (15) positioned in the rotating component (3) and a second transceiver device (16) which faces the first transceiver device (15) and is positioned in the stationary component (2); two first connection lines (19), each of which connects a sensor (10) to a first amplifier (18); and a multiplexer (39) having two inputs connected to the two first amplifiers (18) and a single output which is connected to the first transceiver device (15) of the single communication unit (14).

Monitoring system (12) for a mobile component (3), for example a rotating component, supported by a stationary component (2). The monitoring system (12) comprises: an acoustic sensor (10) which is positioned in the mobile component (3); a first amplifier (18) which is positioned in the mobile component (3); a contactless communication unit (14) provided with a first transceiver device (15) positioned in the mobile component (3) and of a second transceiver device (16) which faces the first transceiver device (15) and is positioned in the stationary component (2); a first connection line (19) connecting the sensor (10) to the first amplifier (18), an analog-to-digital converter (37) which is positioned in the movable component (3) or in the stationary component (2) and is configured to receive an analog signal and convert the analog signal into a digital signal, and a processing device (38) that is positioned in the movable component (3) or in the stationary component (2) and is configured to receive the digital signal from the analog-to-digital converter (37), process the digital signal, and obtain and output a processed digital signal.

A concrete surface processing machine (100) for processing a concrete surface, wherein the concrete surface processing machine is arranged to be supported on the concrete surface by one or more support elements (150) extending in a base plane (101) of the machine parallel to the concrete surface, wherein the concrete surface processing machine is arranged to rotate (R) about an axis (C) normal to the base plane (101) by the one or more support elements (150), wherein the concrete surface processing machine comprises control unit (110) connected to at least one laser range finder (120) arranged pointing in a fixed direction from the concrete surface processing machine, and wherein the control unit (110) is arranged to determine a boundary geometry of the concrete surface based on a sequence of ranges obtained by the laser range finder (120).

An apparatus for monitoring a CMP process on a wafer includes vibration sensors to collect vibration data corresponding to the CMP process and to transmit electric signals, a signal processor to obtain digital signals by converting the electric signals into a frequency domain, and filters to filter out noise signals from the digital signals to obtain noise reduced digital signals. The signal processor obtains one or more frequency spectrums from the noise reduced digital signals, and determines a micro-scratch occurrence on the wafer by analyzing the obtained one or more frequency spectrums. The vibration sensors are in rigid contact with at least a tool such as a head holding a carrier of the wafer or a platen holding a polishing pad. Each vibration sensor includes at least two sub-frequency-ranges respectively corresponding to at least two materials to be polished by the polishing pad.

A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and an in-situ acoustic emission monitoring system including an acoustic emission sensor supported by the platen, a waveguide configured to extending through at least a portion of the polishing pad, and a processor to receive a signal from the acoustic emission sensor. The in-situ acoustic emission monitoring system is configured to detect acoustic events caused by deformation of the substrate and transmitted through the waveguide, and the processor is configured to determine a polishing endpoint based on the signal.

A concrete surface processing machine (100) for processing a concrete surface, wherein the concrete surface processing machine is arranged to be supported on the concrete surface by one or more support elements (150) extending in a base plane (101) of the machine parallel to the concrete surface, wherein the concrete surface processing machine comprises a control unit (110) connected to at least one linear photo sensor (130) extending transversally to the base plane (101), and wherein the control unit (110) is arranged to detect a height (h) of an incoming laser beam (H) relative to the base plane (101), based on a point of incidence of the incoming laser beam (H) on the linear photo sensor (130).

A device for removing burrs from an aluminum alloy wheel includes a workbench, columns fixedly connected to the workbench, a brush, a spindle, a spindle box, a cross beam connected to and adjustable along the columns, a spindle motor, a controller, a parallel robot, and a displacement sensor. The spindle box is connected to the cross beam and moves horizontally on the cross beam; the spindle, the spindle motor and the controller are mounted on the spindle box, and the brush is mounted at the end of the spindle; the brush is driven by the spindle motor and controlled by the controller; and the displacement sensor is mounted in the brush. The parallel robot is configured to implement precise six-dimensional adjustment, and perform real-time posture adjustment according to the instruction of the controller to ensure that the brush is always attached to the spoke back cavity.

A machine tool comprises a measuring device, which is arranged on the machine tool, a control device, and a tool unit. The measuring device comprises at least one structure-borne sound sensor. T control device is coupled to the measuring device and to the tool unit. The control device is configured to acquire, by means of the measuring device, structure-borne sound signals caused by the machine tool and to determine a state variable, which describes an actual state of the machine tool, by forming a differential spectrum from a broadband reference spectrum and a broadband actual spectrum.