Provided are a silver article formed using pure silver, which has high Vickers hardness and prohibits the occurrence of metal corrosion and the occurrence of discoloration; and its method. Disclosed are a silver article and its method, wherein the Vickers hardness is adjusted to 60 HV or higher, and when the height of the peak of 2θ=38°±0.2° by an XRD is designated as h1, and that of 2θ=44°±0.4° is designated as h2, h2/h1 is adjusted to 0.2 or greater.

A handheld power tool with low speed includes a housing, a middle sleeve shell and a front sleeve shell connected by threads on the exterior, and a pneumatic motor, a planet gear mechanism, a bearing, a cushion member and a fastened base in the interior. The pneumatic motor connects the planet gear mechanism through a driving shaft. The planet gear mechanism connects a grinding member located in the fastened base through a driven shaft and a flexible shaft. An outer flange portion is disposed around the fastened base. An inner flange portion is disposed on the front sleeve shell in order to press the outer flange portion while the middle sleeve shell is locked by the front sleeve shell so that the fastened base, the cushion member, the bearing, the planet gear mechanism and the pneumatic motor are fixed in a row.

The invention relates to a method for the automated grinding of surfaces and to a corresponding device. According to one exemplary embodiment, the method comprises the robot-assisted positioning of a grinding machine with a grinding tool, so that the grinding tool contacts the surface when the grinding machine is operated at a first rotational speed, and the detection of the contact between the grinding tool and the surface. The method further comprises, as a result of detecting the contact, the increase in the rotational speed of the grinding tool from the first rotational speed to a second rotational speed.

A grinding machine tool with random eccentric orbital motion speed detection, the grinding machine tool comprises a body and a grinding disc, the body comprises a driving shaft and a tool holder connecting the grinding disc and having an eccentric distance relative to the driving shaft, and the grinding disc performs grinding in a random eccentric orbital motion when the driving shaft rotates. The grinding disc comprises at least one detected member on a side of the grinding disc facing the body for detecting a speed of the random eccentric orbital motion, and the at least one detected member defines a detection area with a range greater than or equal to twice the eccentric distance. Thereby, an accurate speed of the grinding disc performing the random eccentric orbital motion is obtained, so that the grinding operation of precision grinding which is gradually performed by automation is more precisely controlled.

The present application relates to a method for controlling a repairing apparatus and a repairing apparatus. The method for controlling the repairing apparatus includes: measuring, by a sensor, a height of a target object when a grinding part of the repairing apparatus completes positioning the target object; calculating an idle distance of a grinding belt on the grinding part in a predetermined process according to the height of the target object, in which, the predetermined process is the grinding part descending from the initial position to the highest position of the target object; and driving a motor to rotate back the grinding belt on the grinding part for the idle distance, and repairing the target object through the grinding belt on the grinding part.

The present application relates to systems and methods for obtaining real-time abrasion data. An example computer-implemented method could include receiving, at a computing device, sensor data from one or more sensors. The one or more sensors are disposed in proximity to an abrasive product or a workpiece associated with the abrasive product. The one or more sensors are configured to collect abrasion operational data associated with an abrasive operation involving the abrasive product or the workpiece. The computer-implemented method could further include training, based on the sensor data, a machine learning system to determine product specific information of the abrasive product and/or workpiece specific information. The computer-implemented method could also include providing the trained machine learning system using the computing device.

A method for forming semiconductor devices includes: grinding a backside of a semiconductor wafer with a grinding wheel during a first time interval, wherein the grinding wheel is forward moved during the first time interval, wherein a plurality of semiconductor devices are formed on the semiconductor wafer; and polishing the backside of the semiconductor wafer with the grinding wheel in a second time interval, wherein the grinding wheel is backward moved during the second time interval.

A method for forming semiconductor devices includes: grinding a backside of a semiconductor wafer with a grinding wheel during a first time interval, wherein the grinding wheel is forward moved during the first time interval, wherein a plurality of semiconductor devices are formed on the semiconductor wafer; polishing the backside of the semiconductor wafer with the grinding wheel in a second time interval, wherein the grinding wheel is backward moved during the second time interval; and dicing the semiconductor wafer to separate the plurality of semiconductor devices from each other without additional polishing of the backside of the semiconductor wafer before dicing the semiconductor wafer.

Method and system, including: a strip of metallic material used by a bender to produce the 3-D signage; a sanding unit coupled to the bender and configured to sand away any dirt, oil, or other undesirable material attaching to the strip of metallic material; and a controller configured to make a measurement of how fast the strip of metallic material is feeding into the bender, and to control an operating speed of the sanding unit based on the measurement.

The present application relates to systems and methods for obtaining real-time abrasion data. An example system includes a remote sensor that is located remotely from a grinding tool and a workpiece. The remote sensor is configured to detect vibration and/or noise associated with a grinding operation involving the grinding tool and the workpiece. The system includes communication interface and a controller configured to carry out operations. The operations include receiving, from the remote sensor, at least one of vibration or noise information associated with the grinding tool and the workpiece. The operations also include determining tool-specific information or workpiece-specific information based on the at least one of the vibration or noise information. The operations yet further include transmitting, via the communication interface, the tool-specific information or workpiece-specific information. The system also includes a remote computing device configured to receive the transmitted tool-specific information or workpiece-specific information.