The substrate polishing system, according to an example embodiment, includes a plurality of polishing apparatuses configured to sequentially polish a substrate, and each of the polishing apparatuses includes a polishing platen polishing a substrate, a data collector collecting a signal generated in a polishing process of the substrate, a data analyzer detecting a thickness of a substrate by analyzing the collected signal, and a polishing endpoint detector determining a polishing endpoint of a substrate based on the detected thickness of a substrate, and the plurality of polishing apparatuses is configured to share data with each other, and based on a polishing order of a substrate, the data obtained from one polishing apparatus of the plurality of polishing apparatuses is configured to be reflected in a detection process of a substrate thickness detection of another polishing apparatus of the plurality of polishing apparatuses in next sequence.

A processing apparatus includes: a chuck table that is configured to be capable of rotation in a state of supporting the workpiece; a processing unit including a spindle to which a processing tool for grinding or polishing is mounted and a drive source that rotates the spindle; a measuring unit that measures distribution of thickness of the workpiece; a laser beam applying unit that has an adjustor for adjusting power of a laser beam applied to the workpiece; and a control unit including a power setting section that sets the power of the laser beam applied to an arbitrary region of the workpiece based on the distribution of the thickness of the workpiece measured by the measuring unit, and an adjustor control section that controls the adjustor of the laser beam applying unit such as to realize the power of the laser beam set by the power setting section.

A three-dimensional shape measuring instrument is provided for measuring a three-dimensional shape of the polishing subject face. A polishing controller is provided for controlling a polishing robot alone or with a polishing tool, based on three-dimensional shape data of the polishing subject face obtained by the shape measurement by the three-dimensional shape measuring instrument. The polishing tool provides a polishing action on the respective part of the polishing subject face through controlling of the polishing robot alone or with the polishing tool by the polishing controller. By controlling a measuring robot and the three-dimensional shape measuring instrument by the polishing controller, the three-dimensional shape measuring instrument moves to a predetermined measuring position relative to the polishing subject face to measure the three-dimensional shape of the polishing subject face.

Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.

In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

Disclosed is a device for automatically removing burrs from a riser of an aluminum alloy wheel. The device is composed of a frame, a clamping gear rack structure, a support plate, a servo motor and the like. When a clamping cylinder drives a first sliding plate to move, clamping wheels are controlled to center and clamp the wheel, and the servo motor controls the rotation of the clamping wheels, so that the wheel may rotate while being clamped. When a distance adjusting cylinder drives a second sliding block to move, a first sliding block and the second sliding block move synchronously under the action of a feed gear rack structure, so that a first deburring tool and a second deburring tool move synchronously to adjust the distance between them according to the diameter of a cap slot.

Disclosed is a device for automatically removing burrs from a riser of an aluminum alloy wheel. The device is composed of a frame, a clamping gear rack structure, a support plate, a servo motor and the like. When a clamping cylinder drives a first sliding plate to move, clamping wheels are controlled to center and clamp the wheel, and the servo motor controls the rotation of the clamping wheels, so that the wheel may rotate while being clamped. When a distance adjusting cylinder drives a second sliding block to move, a first sliding block and the second sliding block move synchronously under the action of a feed gear rack structure, so that a first deburring tool and a second deburring tool move synchronously to adjust the distance between them according to the diameter of a cap slot.

A microchannel electrophoresis-assisted micro-ultrasonic machining apparatus based on a 3D printing mold includes a working platform, a power supply, a 3D printing mold, a working solution tank and an ultrasonic vibration system. The working platform is configured to secure the apparatus. The working solution tank is provided with electrophoresis-assisted electrodes. The ultrasonic vibration system is secured to the lower end of the transfer module. The positive electrode of the electrophoretic DC power supply is electrically connected to the tool and the negative electrode is electrically connected to the electrophoresis-assisted electrodes. A workpiece to be processed is assembled with a 3D printing mold. After assembly, the workpiece and the 3D printing mold are placed in the middle of the electrophoresis-assisted electrodes inside the working solution tank and arranged to correspond to the tool.

A microchannel electrophoresis-assisted micro-ultrasonic machining apparatus based on a 3D printing mold includes a working platform, a power supply, a 3D printing mold, a working solution tank and an ultrasonic vibration system. The working platform is configured to secure the apparatus. The working solution tank is provided with electrophoresis-assisted electrodes. The ultrasonic vibration system is secured to the lower end of the transfer module. The positive electrode of the electrophoretic DC power supply is electrically connected to the tool and the negative electrode is electrically connected to the electrophoresis-assisted electrodes. A workpiece to be processed is assembled with a 3D printing mold. After assembly, the workpiece and the 3D printing mold are placed in the middle of the electrophoresis-assisted electrodes inside the working solution tank and arranged to correspond to the tool.

A wafer polishing method includes acquiring in-plane thickness distribution information regarding a wafer to be polished or a wafer subjected to the same processing treatment, determining a difference in pressure between a pressure Pc to be applied to the central part of the wafer by introducing a gas into the central region and a pressure Pe to be applied to the outer peripheral part of the wafer by introducing a gas into the outer peripheral region, determining any one pressure of Pc and Pe, and determining the other pressure, determining the pressure Pg to be applied, based on a set value Pr of a contact pressure to be applied to the lower surface of the second ring-shaped member due to contact with the polishing pad at the time of polishing, and bringing the lower surface of the wafer into contact with the polishing pad to conduct polishing.