A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the device including: a polishing table provided with the polishing member and configured to be rotatable; a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table; a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached thereto; and a processor configured to generate the feature amount from the signal regarding the frictional force between the polishing member and the substrate in polishing or the feature amount from the temperature of the polishing member or a target substrate in polishing, and output the data regarding the film thickness of the polished substrate or any of the parameters related to the yield of the product included in the polished substrate, as an estimated value, by inputting the generated feature amount to the learned machine learning model.

An ice blade measuring system comprises a holder for holding an ice blade in a measurement position, and a non-contact measuring device operationally positioned relative to the holder to measure at least a three-dimensional (3D) shape of an ice contacting surface of the ice blade held in the holder. The non-contact measuring device is configured to create a dataset which corresponds to the measured 3D shape. The system further comprises a data storage means operatively connected to the non-contact measuring device to record the measured dataset.

An ice blade measuring system comprises a holder for holding an ice blade in a measurement position, and a non-contact measuring device operationally positioned relative to the holder to measure at least a three-dimensional (3D) shape of an ice contacting surface of the ice blade held in the holder. The non-contact measuring device is configured to create a dataset which corresponds to the measured 3D shape. The system further comprises a data storage means operatively connected to the non-contact measuring device to record the measured dataset.

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core positioned at least partially in the platen and a coil wound around a portion of the core. The core includes a back portion and a multiplicity of posts extending from the back portion in a first direction normal to the surface of the platen. The core and coil are configured such that the multiplicity of posts include a first plurality of posts to provide a first magnetic polarity and a second plurality of posts to provide an opposite second magnetic polarity, and the first plurality of posts and the second plurality of posts are arranged in an alternating pattern.

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core positioned at least partially in the platen and a coil wound around a portion of the core. The core includes a back portion and a multiplicity of posts extending from the back portion in a first direction normal to the surface of the platen. The core and coil are configured such that the multiplicity of posts include a first plurality of posts to provide a first magnetic polarity and a second plurality of posts to provide an opposite second magnetic polarity, and the first plurality of posts and the second plurality of posts are arranged in an alternating pattern.

A processing apparatus includes: a chuck table that is configured to be capable of rotation in a state of supporting the workpiece; a processing unit including a spindle to which a processing tool for grinding or polishing is mounted and a drive source that rotates the spindle; a measuring unit that measures distribution of thickness of the workpiece; a laser beam applying unit that has an adjustor for adjusting power of a laser beam applied to the workpiece; and a control unit including a power setting section that sets the power of the laser beam applied to an arbitrary region of the workpiece based on the distribution of the thickness of the workpiece measured by the measuring unit, and an adjustor control section that controls the adjustor of the laser beam applying unit such as to realize the power of the laser beam set by the power setting section.

Tool bodies, tools and machines for operating the tool include electronic circuits for providing data, collecting data, analyzing data and for controlling machines based on such data. Tool bodies and tools may include electronic circuits having data collecting sensors, which may be embedded in a housing with the electronic circuit and/or positioned outside of such a housing. Sensors include temperature sensors, motion sensors, strain sensors, moisture sensors, electrical resistance sensors, position sensors, antennas, and other components.

Tool bodies, tools and machines for operating the tool include electronic circuits for providing data, collecting data, analyzing data and for controlling machines based on such data. Tool bodies and tools may include electronic circuits having data collecting sensors, which may be embedded in a housing with the electronic circuit and/or positioned outside of such a housing. Sensors include temperature sensors, motion sensors, strain sensors, moisture sensors, electrical resistance sensors, position sensors, antennas, and other components.

The present embodiments provide a mechanism for computing a thickness of a scanned wafer shape to determine a profile, and computing a delta correction value and a polishing end point time by using a computed PV value by the profile and a set predicted PV value and reflecting the same on the polishing time of each wafer which is under polishing. Accordingly, excellent flatness of a wafer surface can be achieved and simultaneously, a plurality of controllers can be controlled simultaneously to reduce equipment cost.

When a work W rotates counterclockwise about an axis O.sub.w and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O.sub.1 and a grinding wheel (2) which rotates clockwise about an axis O.sub.2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S.sub.1 and a second stress sensor S.sub.2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.