Pressure disturbances in a pneumatic robotic force control device—including force overshoot upon initial contact between a robotic tool and a workpiece—are mitigated by increasing the mass air flow in or out of a pneumatic chamber via one or more force overshoot mitigation air passages formed in the robotic force control device. The force overshoot mitigation air passages may connect the two chambers in air flow relationship, or may allow air flow from a chamber to the exterior. The force overshoot mitigation air passages may have a static or variable effective area. The optimal area may be calculated based on measured flow rates and pressures during typical use cases.

Pressure disturbances in a pneumatic robotic force control device—including force overshoot upon initial contact between a robotic tool and a workpiece—are mitigated by increasing the mass air flow in or out of a pneumatic chamber via one or more force overshoot mitigation air passages formed in the robotic force control device. The force overshoot mitigation air passages may connect the two chambers in air flow relationship, or may allow air flow from a chamber to the exterior. The force overshoot mitigation air passages may have a static or variable effective area. The optimal area may be calculated based on measured flow rates and pressures during typical use cases.

A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

A slide grinding machine having a turntable and a work container rotated by the turntable has an air pressure operated automatic gap setting feature having a zero gap width reference value to adjust the gap width between the turntable and the work container.

A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.

A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.

A polishing apparatus capable of enabling a user to know a frequency and a trend of a retry operation of retrying a substrate release operation is disclosed. The polishing apparatus includes: a substrate holder configured to press a substrate against a polishing pad; a fluid ejection system configured to eject a fluid into a gap between the substrate and a flexible membrane for releasing the substrate from a substrate holding surface; an operation controller configured to instruct the fluid ejection system to perform a retry operation of ejecting the fluid again in a case where the release of the wafer has failed; and a monitoring device configured to store a historical information of the retry operation.

In a method of monitoring a vibratory grinding process, parameters from different parameter groups are detected and evaluated to output a command for operating the vibratory grinding system.

In a method of monitoring a vibratory grinding process, parameters from different parameter groups are detected and evaluated to output a command for operating the vibratory grinding system.