An attachment for a mobile handling device is configured for processing walls or ceilings. The attachment comprises a mounting unit that is arranged to be supported at a mounting interface of the handling device, a processing head that is arranged to be equipped with at least one tool for material-removing processing or smoothing processing, and a compensation arrangement that is arranged between the mounting unit and the processing head and that defines a longitudinal axis. The mounting unit provides at least two pivot positions for the attachment that are offset from one another. The processing head is movable relative to the mounting unit in a longitudinal direction along the longitudinal axis. The compensation arrangement is configured to provide a defined contact pressure force for the processing head in a defined operating range along the longitudinal axis towards the surface to be processed.

An attachment for a mobile handling device is configured for processing walls or ceilings. The attachment comprises a mounting unit that is arranged to be supported at a mounting interface of the handling device, a processing head that is arranged to be equipped with at least one tool for material-removing processing or smoothing processing, and a compensation arrangement that is arranged between the mounting unit and the processing head and that defines a longitudinal axis. The mounting unit provides at least two pivot positions for the attachment that are offset from one another. The processing head is movable relative to the mounting unit in a longitudinal direction along the longitudinal axis. The compensation arrangement is configured to provide a defined contact pressure force for the processing head in a defined operating range along the longitudinal axis towards the surface to be processed.

A power tool includes a housing, an output shaft, and a tool holder connected to the output shaft. A rotor assembly is attached to the output shaft that is configured to be acted on by a fluid flow through the housing to cause rotation of the output shaft. A centrifugally movable fluid flow governor is coupled to the output shaft that is configured to move outwardly from the output shaft to alter a force acting on the rotor assembly when the output shaft reaches a predetermined speed.

A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

A polishing device has a substrate stage which holds a substrate Wf, a processing head which processes a surface of the substrate Wf, an indentation detecting system which detects a position of an indentation in the substrate Wf, a movement mechanism which moves the processing head in a radial direction of the substrate stage, and a rotation mechanism which rotates the substrate stage, and the indentation detecting system has a fluid injection nozzle configured to inject a fluid to a circumferential edge portion of the substrate Wf when the substrate Wf is held on the substrate stage, a fluid measuring device which measures a physical quantity which is pressure or a flow rate of the fluid, and a position detector which detects the position of the indentation formed in the circumferential edge portion of the substrate Wf based on a change in physical quantity.

A grinding machine includes a rotatable spindle having a lower end to which a grindstone for grinding a wafer is attached; linear guides supporting the spindle slidably to a column; a spindle feeding mechanism feeding the spindle in a vertical direction; and constant-pressure feeding mechanism interposed between the spindle feeding mechanism and the column and suspending the spindle feeding mechanism. The constant-pressure feeding mechanism raises the spindle feeding mechanism in the vertical direction when a friction force acting on the grindstone is higher than a predetermined value.

A grinding machine includes a rotatable spindle having a lower end to which a grindstone for grinding a wafer is attached; linear guides supporting the spindle slidably to a column; a spindle feeding mechanism feeding the spindle in a vertical direction; and constant-pressure feeding mechanism interposed between the spindle feeding mechanism and the column and suspending the spindle feeding mechanism. The constant-pressure feeding mechanism raises the spindle feeding mechanism in the vertical direction when a friction force acting on the grindstone is higher than a predetermined value.

A method, which can accurately determine in a short time a relationship between a load of a dresser and a pressure of a gas supplied to an air cylinder, is disclosed. The method includes determining a first contact point where a load measurement device is brought into contact with a polishing table, calculating a relational expression composed to a quadratic function showing a relationship between a measured load and a measured pressure, determining a second contact point where the dresser is brought into contact with a polishing surface of a polishing pad, calculating an amount of correction from the pressure of the gas at the first contact point and the pressure of the gas at the second contact point, and correcting the relational expression based on the calculated amount of correction.