A method for controlling operation of an abrading system (500) comprises: —providing an abrading head (300), which comprises an abrading device (200) and a communication unit (MOD1), —providing parameter data (PAR1) associated with the abrading device (200), —storing the parameter data (PAR1) into a memory (MEM2) of the communication unit (MOD1), —transporting the abrading head (300) to an abrading site (SITE1), —electrically connecting the abrading head (300) to a driving unit (400) at the abrading site (SITE1), —transferring the parameter data (PAR1) from the communication unit (MOD1) to the driving unit (400) at the abrading site (SITE1), and —driving an electric motor (MOTOR1) of the abrading device (200) with the driving unit (400) according to the parameter data (PAR1).

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

Included are a polishing table provided with an eddy current sensor, the polishing table configured to rotate; a polishing head configured to face the polishing table, the polishing head configured to rotate, the polishing head having a surface which faces the polishing table and to which a substrate is configured to be attached; and a processor configured to generate preprocessed data on a target substrate by executing predetermined preprocessing on an output signal when the eddy current sensor is at each position facing a target substrate during polishing processing of a target substrate to determine a metal line height at at least one position of the target substrate by inputting preprocessed data on the target substrate to a learned machine learning model using a learning data set in which data after predetermined preprocessing is executed on an output signal when the eddy current sensor is at each position facing a substrate is set as an input and a metal line height at at least one position of the substrate is set as an output.

A polishing apparatus capable of obtaining a desired film thickness profile is disclosed. The polishing apparatus includes: a polishing unit; a film thickness measuring device for measuring a film thickness profile of a substrate; and a controller for controlling at least operations of the polishing unit and the film thickness measuring device. The controller stores in advance a response model which is created by taking into consideration variation in an amount of polishing between monitored areas of the substrate due to variations in a pressure of a pressurized fluid supplied to each of pressure chambers. Further, the controller obtains a film thickness profile of the substrate before polishing by use of a film thickness measuring device, and causes the substrate to be polished with an optimized polishing recipe created based on the response model and a target polishing amount, which is a difference between the film thickness profile of the substrate before polishing and the target film thickness of the substrate. A next substrate is polished with a new optimized polishing recipe which is created based on a target polishing amount of the next substrate and a response model corrected by use of the optimized polishing recipe and film thickness profiles of the substrate before and after polishing.

An apparatus for verifying the presence, or the absence, of an abrasive element in a machine for finishing surfaces comprising a support body configured to removably engage the abrasive element. The support body and the abrasive element are, respectively, provided, at respective engagement surfaces with first and second engagement elements configured to move from an engagement configuration to a disengagement configuration, and vice versa. Furthermore, a displacement device is provided to move the support body in the space according to at least 1 degree of freedom. The apparatus, furthermore, provides at least a control station equipped with a control device comprising a control element having a control surface provided with third engagement elements configured to engage with the first engagement elements of the support body, and a detection device configured to detect if an engagement between the control element and the support body has taken place.

An apparatus for verifying the presence, or the absence, of an abrasive element in a machine for finishing surfaces comprising a support body configured to removably engage the abrasive element. The support body and the abrasive element are, respectively, provided, at respective engagement surfaces with first and second engagement elements configured to move from an engagement configuration to a disengagement configuration, and vice versa. Furthermore, a displacement device is provided to move the support body in the space according to at least 1 degree of freedom. The apparatus, furthermore, provides at least a control station equipped with a control device comprising a control element having a control surface provided with third engagement elements configured to engage with the first engagement elements of the support body, and a detection device configured to detect if an engagement between the control element and the support body has taken place.

A dicing device includes: a workpiece table; a cutting unit including a blade and a spindle; an XY-direction drive unit; a Z-direction drive unit; a first measuring instrument for measuring a Z-direction position of a surface of a workpiece held on a holding surface of the workpiece table; a second measuring instrument for measuring a Z-direction displacement of the holding surface; a correction amount calculation unit for calculating a correction amount for the Z-direction position of the cutting unit based on a table displacement map showing the Z-direction displacement at each position on the holding surface, the Z-direction displacement having been measured in advance by the second measuring instrument and based on the Z-direction position of the surface of the workpiece, measured by the first measuring instrument; and a control unit for controlling, when the workpiece is cut by a blade, the Z-direction drive unit based on the correction amount.

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.